How Rohm Designs Compact Semiconductor Packages for Better Heat Management
A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices.
Original patent title: “USRE49912E1 - Semiconductor device”
A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices. Granted to Rohm Co Ltd in 2024 with 66 claims.
Key facts
Coverage
What does this patent actually cover?
This patent describes a specific physical layout for a semiconductor package containing multiple chips and driving circuits. It uses a series of island parts (which act as mounting bases) and lead terminals (the metal pins that connect the chip to a circuit board) arranged in a precise geometric pattern. By varying the lengths, widths, and heights of these terminals and their connections, the design manages how heat is dissipated and how electrical signals are routed within the resin-encapsulated package. A key feature is the inclusion of a recess in the resin that allows for a heat radiation layer to directly contact or sit near the mounting islands, improving thermal efficiency.
The gap
What does this patent NOT cover?
- Does not cover general semiconductor chip manufacturing or the internal logic of the chips themselves.
- Does not cover packaging designs that lack the specific multi-island and multi-terminal arrangement described in claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1.
- Does not cover cooling systems that rely exclusively on external fans or liquid cooling rather than the integrated heat radiation layer.
- Does not cover packaging that uses non-resin encapsulation materials.
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
What made this novel
The design uses the physical geometry of the lead terminals—specifically their varying lengths and widths—to create a cascading layout that optimizes both signal path distance and heat distribution, rather than relying solely on external heat sinks.
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
Power management integrated circuits (PMICs)
Automotive electronic control units
Compact motor driver modules
Why it matters
The bigger picture
As electronic devices shrink, managing heat in tightly packed chips becomes a major engineering bottleneck. This patent provides a structural blueprint for manufacturers to pack more processing power into a smaller footprint without the device overheating or failing due to poor electrical routing. It is particularly relevant for power electronics where multiple driving chips must coexist with logic chips.
Filed
June 28, 2021
Granted
April 9, 2024
Market context
Who's building on this
Companies in this space
Rohm Co Ltd remains the primary entity developing this technology. Other major semiconductor packaging firms like Amkor Technology or ASE Group often utilize similar structural innovations to improve the thermal performance of high-density integrated circuits.
Market impact
This patent reinforces the trend toward highly integrated, application-specific packaging. It helps manufacturers avoid the need for larger, bulkier cooling solutions, which is essential for the ongoing miniaturization of automotive and industrial control hardware.
Claim 1 — Plain English
What this patent covers
This patent describes a specific physical layout for a semiconductor package containing multiple chips and driving circuits. It uses a series of island parts (which act as mounting bases) and lead terminals (the metal pins that connect the chip to a circuit board) arranged in a precise geometric pattern. By varying the lengths, widths, and heights of these terminals and their connections, the design manages how heat is dissipated and how electrical signals are routed within the resin-encapsulated package. A key feature is the inclusion of a recess in the resin that allows for a heat radiation layer to directly contact or sit near the mounting islands, improving thermal efficiency.
The clever bit
The design uses the physical geometry of the lead terminals—specifically their varying lengths and widths—to create a cascading layout that optimizes both signal path distance and heat distribution, rather than relying solely on external heat sinks.
What it does not cover
- Does not cover general semiconductor chip manufacturing or the internal logic of the chips themselves.
- Does not cover packaging designs that lack the specific multi-island and multi-terminal arrangement described in claim 1.
- Does not cover cooling systems that rely exclusively on external fans or liquid cooling rather than the integrated heat radiation layer.
- Does not cover packaging that uses non-resin encapsulation materials.
Patent timeline
Application submitted to the patent office
Application published, typically 18 months after filing
Patent officially issued
PatentBrief Score
Impact Score
Moderate
Citation count
0/40
No citations yet
Claim breadth
20/20
Very broad protection
Recency
20/20
Granted within 5 years
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$50K – $161K
Midpoint $101K · 15.0 yr remaining · industry ×1.4
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
The original legal language
Original claims
66 claims as filed with the patent office.
Concepts involved
Citations
Patent lineage
Cite this patent
Kimura, A. (2024). How Rohm Designs Compact Semiconductor Packages for Better Heat Management (U.S. Patent No. RE49,912). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/RE49912/rotomolded-cooler
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does How Rohm Designs Compact Semiconductor Packages for Better Heat Management cover?
A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices.
Who owns patent US RE49912?
Rohm Co Ltd owns this patent, granted in 2024.
When does this patent expire?
This patent is expected to expire on April 9, 2044, when the invention enters the public domain.
What problem does this patent solve?
As electronic devices shrink, managing heat in tightly packed chips becomes a major engineering bottleneck. This patent provides a structural blueprint for manufacturers to pack more processing power into a smaller footprint without the device overheating or failing due to poor electrical routing. It is particularly relevant for power electronics where multiple driving chips must coexist with logic chips.
What does this patent NOT cover?
Does not cover general semiconductor chip manufacturing or the internal logic of the chips themselves.
Patent monitoring