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How Robert Noyce Invented the Modern Integrated Circuit

Robert Noyce's 1959 patent for a semiconductor device that uses evaporated metal leads to connect components directly on a single silicon chip.

Granted 1961ExpiredExpired 1979Owned by Fairchild Semiconductor CorpInvented by Robert N Noyce

Original patent title: “Semiconductor device-and-lead structure

Plain-English explanation by SahiLast reviewed · June 13, 2026

Robert Noyce's 1959 patent for a semiconductor device that uses evaporated metal leads to connect components directly on a single silicon chip. Granted to Fairchild Semiconductor Corp in 1961 with 165 forward citations, and it is now in the public domain.

Coverage

What does this patent actually cover?

This patent describes the planar process, a method for creating integrated circuits by layering materials on a silicon wafer. Instead of using fragile wires to connect individual transistors, the invention uses a thin, evaporated metal film deposited directly onto the silicon surface. This creates a reliable, permanent electrical connection between components on the same chip. It effectively allowed engineers to mass-produce complex electronic circuits as a single, solid piece of material.

The gap

What does this patent NOT cover?

  • Does not cover the invention of the transistor itself.
  • Does not cover non-planar methods of manufacturing semiconductors.
  • Does not cover the specific chemical doping recipes used to create the P-N junctions.
  • Does not cover discrete components that are not integrated onto a single substrate.

These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.

Key facts

Patent numberUS 2981877
StatusExpired
FieldSemiconductors & Chips
AssigneeFairchild Semiconductor Corp
InventorRobert N Noyce
Filed1959
Granted1961
Expires1979 (expired)
Times cited165
LitigationNone on record
Value · $42K$134KMinimal

What made this novel

Noyce realized that by using a protective insulating layer of silicon oxide, he could 'print' the wiring directly onto the chip, solving the problem of how to connect tiny components without manual soldering.

The Patent Drawing

Representative patent drawing for Semiconductor device-and-lead structure (US 2981877)
Representative figure · US 2981877All figures on Google Patents →
Semiconductor device-and-lead …(Primary claim)semiconductorsconsumer electronics

Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.

Where you've seen this

Real-world examples

01

Modern microprocessors like Intel Core series

02

Smartphone application processors

03

Memory chips in solid state drives

Why it matters

The bigger picture

This is the foundational patent for the modern computer age. By enabling the mass production of integrated circuits, it moved electronics from bulky, hand-wired assemblies to the compact, powerful chips that drive every smartphone, computer, and car today. It was the key innovation that allowed Fairchild Semiconductor to dominate the early silicon industry.

Filed

July 30, 1959

Granted

April 25, 1961

Market context

Who's building on this

Companies in this space

Every major semiconductor company today, including Intel, TSMC, and Samsung, relies on the fundamental principles established in this patent. Robert Noyce himself went on to co-found Intel, which scaled this technology into the global standard for computing.

Market impact

This patent triggered the transition from discrete electronics to the integrated circuit era, effectively creating the multi-billion dollar semiconductor industry. It allowed for the exponential growth in computing power known as Moore's Law by making it feasible to pack millions of transistors onto a single piece of silicon.

Claim 1 — Plain English

What this patent covers

This patent describes the planar process, a method for creating integrated circuits by layering materials on a silicon wafer. Instead of using fragile wires to connect individual transistors, the invention uses a thin, evaporated metal film deposited directly onto the silicon surface. This creates a reliable, permanent electrical connection between components on the same chip. It effectively allowed engineers to mass-produce complex electronic circuits as a single, solid piece of material.

The clever bit

Noyce realized that by using a protective insulating layer of silicon oxide, he could 'print' the wiring directly onto the chip, solving the problem of how to connect tiny components without manual soldering.

What it does not cover

  • Does not cover the invention of the transistor itself.
  • Does not cover non-planar methods of manufacturing semiconductors.
  • Does not cover the specific chemical doping recipes used to create the P-N junctions.
  • Does not cover discrete components that are not integrated onto a single substrate.

Patent timeline

Filing

Application submitted to the patent office

Publication

Application published, typically 18 months after filing

Grant

Patent officially issued

Expiration

Patent enters public domain

This patent is in the public domain

See the Freedom to Build guide — what is free to use, what is not, and how to cite this patent.

View guide →

PatentBrief Score

Impact Score

Moderate

Citation count

40/40

Highly cited

Claim breadth

0/20

Narrow claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →

Recency

0/20

Older than 20 years

Assignee scale

0/20

Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →

PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.

Heuristic Value Estimate

What this patent might be worth

Minimal

$42K$134K

Midpoint $84K · expired or expiring · industry ×1.4

Adjust inputs →

Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.

Claim text not yet imported for this patent

Claim text not yet imported for this patent.

Concepts involved

ClaimPrior artNon-obviousnessNoveltySpecificationAssigneePatent term

Citations

Patent lineage

Cites earlier patents

4

earlier patents this invention cites as foundations

View prior art →

Cited by later patents

165

later patents that build on this invention

View patents →

Cite this patent

Noyce, R. N. (1961). How Robert Noyce Invented the Modern Integrated Circuit (U.S. Patent No. 2,981,877). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/2981877/noyce-planar-integrated-circuit

Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.

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Common Questions

Frequently Asked Questions

What does How Robert Noyce Invented the Modern Integrated Circuit cover?

Robert Noyce's 1959 patent for a semiconductor device that uses evaporated metal leads to connect components directly on a single silicon chip.

Who owns patent US 2981877?

Fairchild Semiconductor Corp owns this patent, granted in 1961.

When does this patent expire?

This patent has expired and is now in the public domain — anyone can use the invention freely.

What is patent US 2981877 cited by?

This patent has been cited by 165 later patents that build on its ideas.

What problem does this patent solve?

This is the foundational patent for the modern computer age. By enabling the mass production of integrated circuits, it moved electronics from bulky, hand-wired assemblies to the compact, powerful chips that drive every smartphone, computer, and car today. It was the key innovation that allowed Fairchild Semiconductor to dominate the early silicon industry.

What does this patent NOT cover?

Does not cover the invention of the transistor itself.

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Last reviewed: June 13, 2026 · PatentBrief is not a law firm and this is not legal advice.