The IC Manufacturing Method That Made Silicon Valley Possible
Robert Noyce's planar process patent at Fairchild Semiconductor — the fabrication method that made integrated circuits manufacturable at scale, launching the semiconductor industry and Silicon Valley.
Patent Number
US 2981877
Status
Active
Filing Date
July 30, 1959
Grant Date
April 25, 1961
Expiration
~July 1979 (estimated)
Claims
0
Assignee
Fairchild Semiconductor Corp
Inventors
Robert N Noyce
Citations
165 forward · 4 backward
What it covers
This patent describes the 'planar process' — a specific method for manufacturing transistors and integrated circuits with a flat top surface. The key technique is growing a layer of silicon dioxide (SiO₂) over the entire semiconductor surface, then selectively removing it using photolithography and etching to expose only the regions where doping or metal deposition is needed. This creates a perfectly flat ('planar') top surface, which allows metal interconnect wires to be deposited on top without breaking at steps or edges. Jean Hoerni at Fairchild invented the planar transistor; Noyce realized that the same technique could connect multiple planar transistors on one chip using aluminum metal deposited on the oxide surface — creating a practical integrated circuit without external wires.
What it doesn't cover
- —The integrated circuit concept itself — Kilby patented that at TI (US3138743); this patents the specific manufacturing method
- —Modern photolithography at sub-nanometer scales — the principle is the same but the equipment and resolution have advanced by many orders of magnitude
- —Vertical 3D chip stacking — this covers a fundamentally flat manufacturing process
- —The materials beyond silicon — this process was later adapted for compound semiconductors, but the patent covers silicon
The clever bit
The problem Noyce solved was wire bonding — in early ICs, tiny gold or aluminum wires had to be welded by hand from each component to each other component, under a microscope. This was expensive, fragile, and impossible to scale. Noyce realized that if all the components were at the same surface level (planar), you could simply deposit a pattern of metal on top — like drawing a circuit diagram in metal on the chip surface — and the process could be done photographically, not by hand. This insight turned integrated circuit manufacturing from a craft into a reproducible industrial process. The combination of Kilby's concept (one chip, one material) and Noyce's method (planar, photolithographic interconnects) is what makes the modern semiconductor industry possible.
Why it matters
Noyce died in 1990, before the Nobel Prize went to Kilby (2000). Many historians believe Noyce's practical manufacturing contribution was equal to or greater than Kilby's conceptual one — you can't build an industry on a concept that can't be manufactured consistently. Noyce is also remembered as a cultural force: he created Fairchild and Intel with flat organizational structures, stock options for all employees, and a culture of collaboration that defined Silicon Valley's startup ethos. The people who left Fairchild went on to found dozens of semiconductor companies — they became known as the 'Fairchildren.' Silicon Valley's organizational DNA traces directly to Noyce.
Real-world examples
- 1.Fairchild Semiconductor's first planar transistor (the 2N1613) went into production in 1960 and immediately dominated the market because of its consistency and reliability
- 2.Noyce co-founded Intel in 1968 with Gordon Moore, bringing the planar process with him — Intel's first products were memory chips using this exact manufacturing approach
- 3.Every chip ever made since 1960 — from the Apollo guidance computer to the A17 in an iPhone — uses some version of the planar process
Glossary
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US 2981877 · 2026