PatentBrief

The Integrated Circuit — Putting the Whole Transistor Radio on One Chip

Jack Kilby's 1964 monolithic integrated circuit patent at Texas Instruments — the invention that put multiple electronic components on a single piece of semiconductor, enabling the miniaturization of all modern electronics.

Granted 1964activeExpired 1979Owned by Texas Instruments IncInvented by Jack S Kilby

Original patent title: “Miniaturized electronic circuits

What this patent covers

The actual claim

This patent describes a 'monolithic' integrated circuit — a device where multiple electronic components (transistors, resistors, capacitors) are all fabricated within a single continuous piece of semiconductor material, rather than as separate components wired together. The word 'monolithic' means 'one stone' — every component is made from the same slab of germanium or silicon. Tiny regions of the semiconductor are doped with different impurities to create transistors in some areas, resistors in others, and capacitors between conducting layers. Interconnecting wires are formed on the surface of the chip by depositing thin metal traces. The result is a complete electronic circuit in a package that can be manufactured automatically and made extremely small.

What this patent does NOT cover

The boundaries

  • The planar process — Noyce's complementary patent (US2981877) covers the specific manufacturing technique that made ICs practical
  • CMOS logic — the dominant IC technology today uses a different transistor type than Kilby's original
  • Programmable chips (FPGAs, CPUs) — this patent covers the fabrication concept, not specific circuit architectures
  • Packaging and interconnects between chips — this covers what's on a single semiconductor die, not how chips connect to each other

These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.

What made this novel

Kilby made his key insight in the summer of 1958, just two months after joining Texas Instruments — he was too new to the company to take the summer vacation that most employees took, so he worked alone in an empty lab. The established approach to electronic circuits was to build them from discrete components — each transistor, resistor, and capacitor was a separate manufactured part that had to be soldered together. The fundamental insight was that all of these components could be made from the same semiconductor material. Once you accept that, the entire circuit can be fabricated in one process, on one substrate. Kilby demonstrated his first working integrated circuit — a phase shift oscillator — on September 12, 1958. It was a tangled mess of wires and germanium, but it worked.

Miniaturized electronic circuits(Primary claim)semiconductorsintegrated-circuitscomputingelectronicsmanufacturing

Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.

Where you've seen this

Real-world examples

01

Texas Instruments' first commercial product based on this patent was a hearing aid chip (1962), followed by the U.S. Air Force purchasing ICs for Minuteman missile guidance computers

02

The Apollo spacecraft's guidance computer used integrated circuits from Fairchild Semiconductor — buying enough of them to drive the price down from $1,000 per chip to $25

03

The Intel 4004 (1971) — the first microprocessor — contained 2,300 transistors on a single IC. The iPhone 15's A17 chip contains 19 billion.

Why it matters

The bigger picture

Kilby won the Nobel Prize in Physics in 2000, alongside Herbert Kroemer and Zhores Alferov. His co-inventor Robert Noyce (Fairchild, US2981877) had died in 1990 and was not eligible. The Nobel Committee's citation credited Kilby with 'his part in the invention of the integrated circuit.' The IC is the fundamental reason that computers went from buildings to desks to pockets. Moore's Law — the observation that the number of transistors on a chip doubles every two years — is a direct consequence of the integrated circuit enabling systematic miniaturization of the same basic structure Kilby patented.

Filed

February 6, 1959

Granted

June 23, 1964

Claim 1 — Plain English

What this patent covers

This patent describes a 'monolithic' integrated circuit — a device where multiple electronic components (transistors, resistors, capacitors) are all fabricated within a single continuous piece of semiconductor material, rather than as separate components wired together. The word 'monolithic' means 'one stone' — every component is made from the same slab of germanium or silicon. Tiny regions of the semiconductor are doped with different impurities to create transistors in some areas, resistors in others, and capacitors between conducting layers. Interconnecting wires are formed on the surface of the chip by depositing thin metal traces. The result is a complete electronic circuit in a package that can be manufactured automatically and made extremely small.

The clever bit

Kilby made his key insight in the summer of 1958, just two months after joining Texas Instruments — he was too new to the company to take the summer vacation that most employees took, so he worked alone in an empty lab. The established approach to electronic circuits was to build them from discrete components — each transistor, resistor, and capacitor was a separate manufactured part that had to be soldered together. The fundamental insight was that all of these components could be made from the same semiconductor material. Once you accept that, the entire circuit can be fabricated in one process, on one substrate. Kilby demonstrated his first working integrated circuit — a phase shift oscillator — on September 12, 1958. It was a tangled mess of wires and germanium, but it worked.

What it does not cover

  • The planar process — Noyce's complementary patent (US2981877) covers the specific manufacturing technique that made ICs practical
  • CMOS logic — the dominant IC technology today uses a different transistor type than Kilby's original
  • Programmable chips (FPGAs, CPUs) — this patent covers the fabrication concept, not specific circuit architectures
  • Packaging and interconnects between chips — this covers what's on a single semiconductor die, not how chips connect to each other

Patent Journey

From filing to expiry

Patent Filed

1959

Patent Granted

1964 · 5yr after filing

Patent Expired

1979

PatentBrief Score

Impact Score

30/ 100

Early stage

Citation count

29/40

Moderately cited

Claim breadth

1/20

Narrow claims

Recency

0/20

Older than 20 years

Assignee scale

0/20

Independent or smaller assignee

PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.

The original legal language

Original claims

2 claims as filed with the patent office.

Glossary

Key terms defined

doping
Adding controlled impurities to a semiconductor to create transistors, resistors, and other components within the same material
substrate
The semiconductor wafer (silicon or germanium) on which the integrated circuit is built
monolithic
Made from a single continuous piece of material — in an integrated circuit, all components are fabricated within one semiconductor substrate

Citations

Patent lineage

Cites earlier patents

13

earlier patents this invention cites as foundations

View prior art →

Cited by later patents

26

later patents that build on this invention

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Last reviewed: May 25, 2026 · PatentBrief is not a law firm and this is not legal advice.