Attaching Flexible Circuits with Light Sensors to a Chip
This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part.
Original patent title: “Method for attaching a flexible structure to a device and a device having a flexible structure”
This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part. Granted to International Business Machines in 2015 with 19 claims, and it is expected to expire in 2032.
Coverage
What does this patent actually cover?
The patent describes a device where a bendable component, called a "flexible structure" (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1), is precisely connected to a main "processed substrate" (like a computer chip) using a "patterned bonding layer" (Claim 1). This flexible structure contains special light-sensitive or light-emitting parts, known as "optoelectronic elements," which are connected to "contact elements" on the flexible material. A key feature is a "via," which is a carefully placed hole that goes through both the main substrate and the flexible structure. This via allows light to either enter or exit the optoelectronic element (Claim 1). For example, this could be used to connect a flexible optical sensor to a rigid processor chip, where the sensor needs to receive light from underneath the chip.
The gap
What does this patent NOT cover?
- Devices where the flexible structure does not extend beyond the main substrate (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Devices without a "via" (a hole) that passes through both the substrate and the flexible structure (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Devices where the optoelectronic element is not specifically arranged to transmit or receive light through the via (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Attachment methods that do not use a "patterned bonding layer" between the substrate and the flexible structure (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Devices where the flexible structure does not include a contact element for the optoelectronic element (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The clever part is the precise method of attaching a pre-fabricated flexible circuit, which already contains optoelectronic elements, onto a rigid substrate. This process ensures accurate alignment of a light-guiding hole (via) through both layers, using a patterned adhesive layer for a robust and functional optical and electrical connection.
The Patent Drawing
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
Flexible displays with integrated sensors
Wearable health monitors with optical sensing
Compact optical interconnects for data centers
Miniaturized medical implants with light-based diagnostics
Augmented reality glasses components
Why it matters
The bigger picture
This technology is important for creating compact, high-performance devices that combine rigid electronics with flexible components, especially for optical communication or sensing. It allows for advanced packaging where light signals can be routed directly to or from flexible circuits, which is crucial for miniaturization and new form factors in electronics. This integration can lead to more versatile and smaller devices in various applications.
Filed
July 15, 2012
Granted
June 9, 2015
Market context
Who's building on this
Companies in this space
International Business Machines Corp (IBM), the assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →, continues to research and develop advanced packaging and optoelectronics for high-performance computing. Other companies involved in flexible electronics, such as LG Display and Samsung, and various startups in wearable technology or optical sensing, are also active in related areas, seeking to integrate flexible components with rigid chips for new product capabilities.
Market impact
This type of technology enables the creation of more compact and versatile electronic devices by integrating flexible components directly with rigid chips. It supports the trend towards miniaturization and the development of new form factors in consumer electronics and specialized optical systems. This integration can potentially reduce the overall size and weight of devices while improving their performance and opening doors for novel product designs in areas like wearables and advanced sensors.
Claim 1 — Plain English
What this patent covers
The patent describes a device where a bendable component, called a "flexible structure" (Claim 1), is precisely connected to a main "processed substrate" (like a computer chip) using a "patterned bonding layer" (Claim 1). This flexible structure contains special light-sensitive or light-emitting parts, known as "optoelectronic elements," which are connected to "contact elements" on the flexible material. A key feature is a "via," which is a carefully placed hole that goes through both the main substrate and the flexible structure. This via allows light to either enter or exit the optoelectronic element (Claim 1). For example, this could be used to connect a flexible optical sensor to a rigid processor chip, where the sensor needs to receive light from underneath the chip.
The clever bit
The clever part is the precise method of attaching a pre-fabricated flexible circuit, which already contains optoelectronic elements, onto a rigid substrate. This process ensures accurate alignment of a light-guiding hole (via) through both layers, using a patterned adhesive layer for a robust and functional optical and electrical connection.
What it does not cover
- Devices where the flexible structure does not extend beyond the main substrate (Claim 1).
- Devices without a "via" (a hole) that passes through both the substrate and the flexible structure (Claim 1).
- Devices where the optoelectronic element is not specifically arranged to transmit or receive light through the via (Claim 1).
- Attachment methods that do not use a "patterned bonding layer" between the substrate and the flexible structure (Claim 1).
- Devices where the flexible structure does not include a contact element for the optoelectronic element (Claim 1).
Patent timeline
Application submitted to the patent office
Application published, typically 18 months after filing
Patent officially issued
Patent enters public domain
PatentBrief Score
Impact Score
Limited data
Citation count
0/40
No citations yet
Claim breadth
13/20
Broad claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →
Recency
5/20
Granted 10–20 years ago
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$19K – $61K
Midpoint $38K · 6.0 yr remaining · industry ×1.4
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Claim text not yet imported for this patent
The original legal language
Original claims
19 claims as filed with the patent office.
Concepts involved
Citations
Patent lineage
Cite this patent
Despont, M., Oggioni, S. S., Offrein, B. J., Dellmann, L., & Dangel, R. (2015). Attaching Flexible Circuits with Light Sensors to a Chip (U.S. Patent No. 9,055,681). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/9055681/method-for-attaching-a-flexible-structure-to-a-device-and-a-device-having-a-flex
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does Attaching Flexible Circuits with Light Sensors to a Chip cover?
This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part.
Who owns patent US 9055681?
International Business Machines owns this patent, granted in 2015.
When does this patent expire?
This patent is expected to expire on July 15, 2032, when the invention enters the public domain.
What problem does this patent solve?
This technology is important for creating compact, high-performance devices that combine rigid electronics with flexible components, especially for optical communication or sensing. It allows for advanced packaging where light signals can be routed directly to or from flexible circuits, which is crucial for miniaturization and new form factors in electronics. This integration can lead to more versatile and smaller devices in various applications.
What does this patent NOT cover?
Devices where the flexible structure does not extend beyond the main substrate (Claim 1).
Same assignee
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