Attaching Flexible Circuits with Light Sensors to a Chip

This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part.

What it covers

The patent describes a device where a bendable component, called a "flexible structure" (Claim 1), is precisely connected to a main "processed substrate" (like a computer chip) using a "patterned bonding layer" (Claim 1). This flexible structure contains special light-sensitive or light-emitting parts, known as "optoelectronic elements," which are connected to "contact elements" on the flexible material. A key feature is a "via," which is a carefully placed hole that goes through both the main substrate and the flexible structure. This via allows light to either enter or exit the optoelectronic element (Claim 1). For example, this could be used to connect a flexible optical sensor to a rigid processor chip, where the sensor needs to receive light from underneath the chip.

What it doesn't cover

• —Devices where the flexible structure does not extend beyond the main substrate (Claim 1).
• —Devices without a "via" (a hole) that passes through both the substrate and the flexible structure (Claim 1).
• —Devices where the optoelectronic element is not specifically arranged to transmit or receive light through the via (Claim 1).
• —Attachment methods that do not use a "patterned bonding layer" between the substrate and the flexible structure (Claim 1).
• —Devices where the flexible structure does not include a contact element for the optoelectronic element (Claim 1).

The clever bit

The clever part is the precise method of attaching a pre-fabricated flexible circuit, which already contains optoelectronic elements, onto a rigid substrate. This process ensures accurate alignment of a light-guiding hole (via) through both layers, using a patterned adhesive layer for a robust and functional optical and electrical connection.

Why it matters

This technology is important for creating compact, high-performance devices that combine rigid electronics with flexible components, especially for optical communication or sensing. It allows for advanced packaging where light signals can be routed directly to or from flexible circuits, which is crucial for miniaturization and new form factors in electronics. This integration can lead to more versatile and smaller devices in various applications.

Real-world examples

• 1.Flexible displays with integrated sensors
• 2.Wearable health monitors with optical sensing
• 3.Compact optical interconnects for data centers
• 4.Miniaturized medical implants with light-based diagnostics
• 5.Augmented reality glasses components