Measuring Focus in Multi-Beam Tools for Tiny Electronics Manufacturing
This patent describes a method to precisely measure how focused tiny particle beams are in advanced manufacturing machines by slightly tilting them and observing where they hit a target.
Original patent title: “Method for determining focal properties in a target beam field of a multi-beam charged-particle processing apparatus”
This patent describes a method to precisely measure how focused tiny particle beams are in advanced manufacturing machines by slightly tilting them and observing where they hit a target. Granted in 2026.
Coverage
What does this patent actually cover?
This patent details a method for figuring out how well focused the individual tiny beams, called beamlets, are in a charged-particle multi-beam processing apparatus. To do this, the system slightly changes an electrostatic voltage in a lens, or another setting in its projection optics, which causes the beamlets to tilt. This tilt makes the beamlets land in slightly different spots on the target surface. By measuring how much the landing positions shift and knowing how much the beamlets tilted, the system creates a map. This map, often made using a mathematical model, then allows the system to extract specific focal properties like the height of focus, astigmatic length, or the size of any blur, which can then be used to correct imaging errors.
The gap
What does this patent NOT cover?
- Does not cover single-beam charged-particle processing apparatus, as it specifically addresses 'multi-beam' systems.
- Does not cover determining focal properties using methods other than tilting beamlets and measuring their displacement.
- Does not cover the actual correction of imaging errors, only the process of determining the focal properties that can then be used for correction.
- Does not cover determining other types of imaging errors beyond focal properties like height of focus, astigmatic length, or blur size.
- Does not cover apparatuses that do not modify an electrostatic voltage of a lens or a similar operating parameter to tilt the beamlets.
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The clever bit is using a small, controlled tilt of the beamlets and precisely measuring their displacement to indirectly calculate complex focal properties. This avoids needing direct, difficult-to-obtain measurements of the beam's focus at the target itself.
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
Electron beam lithography tools for semiconductor manufacturing
Ion beam etching systems
Multi-beam inspection tools for wafer defects
Advanced microscopy systems using multiple charged-particle beams
Why it matters
The bigger picture
In advanced manufacturing, especially for computer chips, tools that use charged particles need extreme precision to create tiny features. If the particle beams aren't perfectly focused, the resulting products can have flaws. This method provides a way to accurately measure these focusing issues, allowing machines to be tuned for optimal performance and ensuring the quality of very small components.
Filed
March 5, 2024
Granted
September 15, 2026
Market context
Who's building on this
Companies in this space
Companies like ASML, Applied Materials, and KLA, which develop and manufacture advanced semiconductor manufacturing and inspection equipment, are likely to be interested in or building upon technologies related to precise beam control. These firms continuously innovate to improve the accuracy and throughput of their charged-particle systems.
Market impact
This type of technology directly impacts the semiconductor industry by enabling the creation of smaller, more complex features on microchips. By improving the precision of multi-beam tools, it helps increase manufacturing yields and pushes the boundaries of what's possible in chip design. This contributes to the ongoing miniaturization and performance improvements seen in consumer electronics and computing.
Claim 1 — Plain English
What this patent covers
This patent details a method for figuring out how well focused the individual tiny beams, called beamlets, are in a charged-particle multi-beam processing apparatus. To do this, the system slightly changes an electrostatic voltage in a lens, or another setting in its projection optics, which causes the beamlets to tilt. This tilt makes the beamlets land in slightly different spots on the target surface. By measuring how much the landing positions shift and knowing how much the beamlets tilted, the system creates a map. This map, often made using a mathematical model, then allows the system to extract specific focal properties like the height of focus, astigmatic length, or the size of any blur, which can then be used to correct imaging errors.
The clever bit
The clever bit is using a small, controlled tilt of the beamlets and precisely measuring their displacement to indirectly calculate complex focal properties. This avoids needing direct, difficult-to-obtain measurements of the beam's focus at the target itself.
What it does not cover
- Does not cover single-beam charged-particle processing apparatus, as it specifically addresses 'multi-beam' systems.
- Does not cover determining focal properties using methods other than tilting beamlets and measuring their displacement.
- Does not cover the actual correction of imaging errors, only the process of determining the focal properties that can then be used for correction.
- Does not cover determining other types of imaging errors beyond focal properties like height of focus, astigmatic length, or blur size.
- Does not cover apparatuses that do not modify an electrostatic voltage of a lens or a similar operating parameter to tilt the beamlets.
Patent timeline
Application submitted to the patent office
Patent officially issued
PatentBrief Score
Impact Score
Early stage
Citation count
0/40
No citations yet
Claim breadth
0/20
Narrow claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →
Recency
20/20
Granted within 5 years
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$17K – $54K
Midpoint $34K · 17.4 yr remaining · industry ×1.4
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Claim text not yet imported for this patent
Concepts involved
Cite this patent
(2026). Measuring Focus in Multi-Beam Tools for Tiny Electronics Manufacturing (U.S. Patent No. 12,738,453). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/12738453/method-for-determining-focal-properties-in-a-target-beam-field-of-a-multi-beam
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does Measuring Focus in Multi-Beam Tools for Tiny Electronics Manufacturing cover?
This patent describes a method to precisely measure how focused tiny particle beams are in advanced manufacturing machines by slightly tilting them and observing where they hit a target.
When does this patent expire?
This patent is expected to expire on September 15, 2046, when the invention enters the public domain.
What problem does this patent solve?
In advanced manufacturing, especially for computer chips, tools that use charged particles need extreme precision to create tiny features. If the particle beams aren't perfectly focused, the resulting products can have flaws. This method provides a way to accurately measure these focusing issues, allowing machines to be tuned for optimal performance and ensuring the quality of very small components.
What does this patent NOT cover?
Does not cover single-beam charged-particle processing apparatus, as it specifically addresses 'multi-beam' systems.
Patent monitoring