How to Combine Pressure and Motion Sensors on One Tiny Chip
This patent describes a method for building a single microchip that contains both a pressure sensor and a motion sensor, making devices smaller and more efficient.
Original patent title: “MEMS sensor device with multi-stimulus sensing”
This patent describes a method for building a single microchip that contains both a pressure sensor and a motion sensor, making devices smaller and more efficient. Granted to Freescale Semiconductor in 2013 with 23 claims and 16 forward citations, and it is expected to expire in 2032.
Coverage
What does this patent actually cover?
This device integrates two different types of tiny sensors, a first sensor (like a pressure sensor) and a second sensor (like an inertial sensor), onto a single chip. It uses a first substrate structure with a cavity and a second substrate structure where the sensors are built. The first sensor sits over the cavity, while the second sensor is positioned next to it, laterally spaced apart (ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1). A cap then encloses both sensors, often creating separate, isolated chambers for each (Claim 8). A clever part of the manufacturing is that key parts of both sensors, such as the pressure sensor's reference element and the inertial sensor's movable element, can be made at the same time from the same wafer material (Claim 4). For example, a smartphone could use this to measure both atmospheric pressure and how it's moving or tilting.
The gap
What does this patent NOT cover?
- Does not cover a device where the first and second sensors are not laterally spaced apart on the second substrate structure.
- Does not cover a device where the first sensor is not aligned with a cavity in the first substrate structure.
- Does not cover a device where the cap does not physically isolate the first sensor's chamber from the second sensor's chamber.
- Does not cover a device where the reference element of the pressure sensor and the movable element of the inertial sensor are not formed concurrently in the wafer substrate.
- Does not cover a device where the first sensor is not a pressure sensor or the second sensor is not an inertial sensor.
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The innovation lies in the specific fabrication process that allows critical components of different sensor types, like a pressure sensor's reference element and an inertial sensor's movable element, to be formed concurrently within the same wafer substrate. This shared manufacturing step simplifies production and improves alignment.
The Patent Drawing
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
Smartphones (for altitude, motion tracking, and gaming)
Wearable fitness trackers (for activity monitoring and elevation changes)
Drones (for flight stability and altitude control)
Automotive sensors (for airbag deployment and electronic stability control)
Why it matters
The bigger picture
Combining multiple sensors onto one chip, known as a multi-stimulus sensing device, is crucial for making electronics smaller, lighter, and more power-efficient. This integration reduces the number of separate components needed, which can lower manufacturing costs and simplify device design. This approach is fundamental for compact devices that need to understand both their environment (like air pressure) and their movement (like acceleration or tilt).
Filed
June 18, 2012
Granted
July 16, 2013
Market context
Who's building on this
Companies in this space
Freescale Semiconductor, the original assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →, was acquired by NXP Semiconductors, which continues to be a major player in integrated MEMS sensors for automotive, industrial, and consumer applications. Other large semiconductor manufacturers like Bosch Sensortec and STMicroelectronics also develop and produce similar multi-sensor integrated circuits.
Market impact
The ability to integrate multiple sensor types onto a single chip significantly impacted the market by enabling the miniaturization of complex sensing capabilities. This led to the proliferation of compact, feature-rich devices like smartphones and wearables, where space and power consumption are critical. It also helped drive down the cost of multi-sensor modules, making advanced sensing accessible to a wider range of products and applications.
Claim 1 — Plain English
What this patent covers
This device integrates two different types of tiny sensors, a first sensor (like a pressure sensor) and a second sensor (like an inertial sensor), onto a single chip. It uses a first substrate structure with a cavity and a second substrate structure where the sensors are built. The first sensor sits over the cavity, while the second sensor is positioned next to it, laterally spaced apart (Claim 1). A cap then encloses both sensors, often creating separate, isolated chambers for each (Claim 8). A clever part of the manufacturing is that key parts of both sensors, such as the pressure sensor's reference element and the inertial sensor's movable element, can be made at the same time from the same wafer material (Claim 4). For example, a smartphone could use this to measure both atmospheric pressure and how it's moving or tilting.
The clever bit
The innovation lies in the specific fabrication process that allows critical components of different sensor types, like a pressure sensor's reference element and an inertial sensor's movable element, to be formed concurrently within the same wafer substrate. This shared manufacturing step simplifies production and improves alignment.
What it does not cover
- Does not cover a device where the first and second sensors are not laterally spaced apart on the second substrate structure.
- Does not cover a device where the first sensor is not aligned with a cavity in the first substrate structure.
- Does not cover a device where the cap does not physically isolate the first sensor's chamber from the second sensor's chamber.
- Does not cover a device where the reference element of the pressure sensor and the movable element of the inertial sensor are not formed concurrently in the wafer substrate.
- Does not cover a device where the first sensor is not a pressure sensor or the second sensor is not an inertial sensor.
Patent timeline
Application submitted to the patent office
Application published, typically 18 months after filing
Patent officially issued
Patent enters public domain
PatentBrief Score
Impact Score
Moderate
Citation count
25/40
Moderately cited
Claim breadth
15/20
Broad claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →
Recency
5/20
Granted 10–20 years ago
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$123K – $393K
Midpoint $246K · 5.7 yr remaining · industry ×1.5
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Claim text not yet imported for this patent
The original legal language
Original claims
23 claims as filed with the patent office.
Concepts involved
Citations
Patent lineage
Cite this patent
Schlarmann, M. E., Desai, H. D., Park, W. T., & Lin, Y. (2013). How to Combine Pressure and Motion Sensors on One Tiny Chip (U.S. Patent No. 8,487,387). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/8487387/mems-sensor-device-with-multi-stimulus-sensing
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does How to Combine Pressure and Motion Sensors on One Tiny Chip cover?
This patent describes a method for building a single microchip that contains both a pressure sensor and a motion sensor, making devices smaller and more efficient.
Who owns patent US 8487387?
Freescale Semiconductor owns this patent, granted in 2013.
When does this patent expire?
This patent is expected to expire on June 18, 2032, when the invention enters the public domain.
What is patent US 8487387 cited by?
This patent has been cited by 16 later patents that build on its ideas.
What problem does this patent solve?
Combining multiple sensors onto one chip, known as a multi-stimulus sensing device, is crucial for making electronics smaller, lighter, and more power-efficient. This integration reduces the number of separate components needed, which can lower manufacturing costs and simplify device design. This approach is fundamental for compact devices that need to understand both their environment (like air pressure) and their movement (like acceleration or tilt).
What does this patent NOT cover?
Does not cover a device where the first and second sensors are not laterally spaced apart on the second substrate structure.
Same assignee
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