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Freescale Semiconductor
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2
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2013
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2 patents, in 2013
Dot size = forward citations
Hover or tap any dot to see the patent. Larger dots indicate more forward citations — a proxy for downstream influence.
US 8387464·2013
Combining Sealed and Exposed Sensors on One Microchip
This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap.
US 8487387·2013
How to Combine Pressure and Motion Sensors on One Tiny Chip
This patent describes a method for building a single microchip that contains both a pressure sensor and a motion sensor, making devices smaller and more efficient.
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