Combining Sealed and Exposed Sensors on One Microchip
This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap.
Original patent title: “Laterally integrated MEMS sensor device with multi-stimulus sensing”
This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap. Granted to Freescale Semiconductor in 2013 with 22 claims and 21 forward citations, and it is expected to expire in 2029.
Coverage
What does this patent actually cover?
This patent describes a microelectromechanical systems (MEMS) sensor device that integrates multiple sensors on a single chip. It includes a substrate with a 'first side' and an opposing 'second side' (claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1). A 'first sensor' and a 'second sensor' are both placed on the 'first side' of this substrate, at different locations (claim 1). The 'second sensor' contains a 'sense element' (claim 1), which is the part that detects physical changes. A key feature is a 'cavity' that extends through the substrate from the 'second side' (the back) to expose this 'sense element' of the second sensor to the external environment (claim 1). This allows the sense element, for example a diaphragm in a pressure sensor, to move in response to an external stimulus like pressure (claim 2). Both the first and second sensors are then enclosed together within a 'hermetically sealed chamber' formed by a cap coupled to the 'first side' of the substrate (claim 1). This setup allows for sensors with different environmental exposure needs to be manufactured on the same chip, such as an inertial sensor (first sensor) and a pressure sensor (second sensor) (claim 3).
The gap
What does this patent NOT cover?
- Does not cover a device where the first and second sensors are placed on opposite sides of the substrate, as both are required to be on the 'first side' (claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Does not cover a device where the cavity for the second sensor's sense element does not extend completely through the substrate from the 'second side' (claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Does not cover a device where both the first and second sensors are directly exposed to the external environment via through-substrate cavities.
- Does not cover a device that lacks a 'hermetically sealed chamber' enclosing both the first and second sensors (claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
- Does not cover a device where the sensors are not 'laterally spaced apart' on the substrate, meaning they are at distinct locations (claimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 1).
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The clever part is integrating sensors with fundamentally different environmental requirements on the same side of a microchip. It allows one sensor (like a pressure sensor) to be exposed to the outside through a precisely etched hole from the back of the chip, while other sensors (like accelerometers) remain protected within a single, shared hermetically sealed chamber, simplifying manufacturing and packaging.
The Patent Drawing
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
Integrated pressure and inertial sensors in smartphones
Multi-sensor modules in smartwatches and fitness trackers
Environmental monitoring sensors in Internet of Things (IoT) devices
Combined altimeter and motion sensors in drones
Why it matters
The bigger picture
This patent addresses a common challenge in microchip manufacturing: how to combine different types of sensors, some needing to be sealed from the outside world (like accelerometers) and others needing direct exposure (like pressure sensors), onto a single, compact chip. By providing a method to expose only specific parts of one sensor through a backside cavity while keeping others sealed under a common cap, it enables the creation of smaller, more efficient multi-sensor modules. This integration is vital for reducing the size, cost, and power consumption of devices that require multiple types of environmental sensing.
Filed
November 30, 2009
Granted
March 5, 2013
Market context
Who's building on this
Companies in this space
Freescale Semiconductor, the original assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →, was acquired by NXP Semiconductors, which continues to be a major player in integrated sensor solutions for automotive, industrial, and mobile markets. Other companies like Bosch Sensortec, STMicroelectronics, and TDK InvenSense also develop and manufacture highly integrated multi-sensor MEMS devices, building on similar principles of combining different sensor types on a single die.
Market impact
This patent contributed to the trend of miniaturization and integration in the sensor market. By enabling the efficient combination of different sensor types with varying environmental needs onto a single chip, it helped reduce the bill of materials and footprint for consumer electronics and IoT devices. This integration facilitated the widespread adoption of multi-sensor modules in smartphones, wearables, and smart home devices, making advanced environmental and motion sensing more accessible and cost-effective for mass production.
Claim 1 — Plain English
What this patent covers
This patent describes a microelectromechanical systems (MEMS) sensor device that integrates multiple sensors on a single chip. It includes a substrate with a 'first side' and an opposing 'second side' (claim 1). A 'first sensor' and a 'second sensor' are both placed on the 'first side' of this substrate, at different locations (claim 1). The 'second sensor' contains a 'sense element' (claim 1), which is the part that detects physical changes. A key feature is a 'cavity' that extends through the substrate from the 'second side' (the back) to expose this 'sense element' of the second sensor to the external environment (claim 1). This allows the sense element, for example a diaphragm in a pressure sensor, to move in response to an external stimulus like pressure (claim 2). Both the first and second sensors are then enclosed together within a 'hermetically sealed chamber' formed by a cap coupled to the 'first side' of the substrate (claim 1). This setup allows for sensors with different environmental exposure needs to be manufactured on the same chip, such as an inertial sensor (first sensor) and a pressure sensor (second sensor) (claim 3).
The clever bit
The clever part is integrating sensors with fundamentally different environmental requirements on the same side of a microchip. It allows one sensor (like a pressure sensor) to be exposed to the outside through a precisely etched hole from the back of the chip, while other sensors (like accelerometers) remain protected within a single, shared hermetically sealed chamber, simplifying manufacturing and packaging.
What it does not cover
- Does not cover a device where the first and second sensors are placed on opposite sides of the substrate, as both are required to be on the 'first side' (claim 1).
- Does not cover a device where the cavity for the second sensor's sense element does not extend completely through the substrate from the 'second side' (claim 1).
- Does not cover a device where both the first and second sensors are directly exposed to the external environment via through-substrate cavities.
- Does not cover a device that lacks a 'hermetically sealed chamber' enclosing both the first and second sensors (claim 1).
- Does not cover a device where the sensors are not 'laterally spaced apart' on the substrate, meaning they are at distinct locations (claim 1).
Patent timeline
Application submitted to the patent office
Application published, typically 18 months after filing
Patent officially issued
Patent enters public domain
PatentBrief Score
Impact Score
Moderate
Citation count
27/40
Moderately cited
Claim breadth
15/20
Broad claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →
Recency
5/20
Granted 10–20 years ago
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$123K – $393K
Midpoint $246K · 3.3 yr remaining · industry ×1.5
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Patent Claims
0 independent claims · 1 dependent
Claims are the legal boundaries of the patent. An independent claim stands alone. A dependent claim adds limitations to its parent, narrowing — but not broadening — the scope.
The original legal language
Original claims
22 claims as filed with the patent office.
Concepts involved
Citations
Patent lineage
Cite this patent
McNeil, A. C., Park, W. T., & Lin, Y. (2013). Combining Sealed and Exposed Sensors on One Microchip (U.S. Patent No. 8,387,464). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/8387464/laterally-integrated-mems-sensor-device-with-multi-stimulus-sensing
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does Combining Sealed and Exposed Sensors on One Microchip cover?
This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap.
Who owns patent US 8387464?
Freescale Semiconductor owns this patent, granted in 2013.
When does this patent expire?
This patent is expected to expire on November 30, 2029, when the invention enters the public domain.
What is patent US 8387464 cited by?
This patent has been cited by 21 later patents that build on its ideas.
What problem does this patent solve?
This patent addresses a common challenge in microchip manufacturing: how to combine different types of sensors, some needing to be sealed from the outside world (like accelerometers) and others needing direct exposure (like pressure sensors), onto a single, compact chip. By providing a method to expose only specific parts of one sensor through a backside cavity while keeping others sealed under a common cap, it enables the creation of smaller, more efficient multi-sensor modules. This integration is vital for reducing the size, cost, and power consumption of devices that require multiple…
What does this patent NOT cover?
Does not cover a device where the first and second sensors are placed on opposite sides of the substrate, as both are required to be on the 'first side' (claim 1).
Patent monitoring