US 8387464
Forward Citations
Combining Sealed and Exposed Sensors on One Microchip
Patents that cite US 8387464 — inventions that reference this patent as foundational prior art in their own applications. High forward citation counts indicate an influential patent.
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21 patents
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This patent has been cited by 21 later patents. Citation detail pages are being built out in Phase 2.
Forward citation data is sourced from the USPTO patent database. Only patents indexed in PatentBrief are shown as links.