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How Buried Channel CCDs Move Data Deep Inside Silicon Chips

A foundational 1974 invention that improved how computer chips store and move electrical charges by keeping them away from messy surface defects.

Granted 1974ExpiredExpired 1993Owned by IndividualInvented by G Smith, W Boyle

Original patent title: “Buried channel charge coupled devices

Plain-English explanation by SahiLast reviewed · June 13, 2026

A foundational 1974 invention that improved how computer chips store and move electrical charges by keeping them away from messy surface defects. Granted to Individual in 1974 with 14 claims and 22 forward citations, and it is now in the public domain.

Coverage

What does this patent actually cover?

This patent describes a way to move electrical charges through the middle of a semiconductor material rather than along its surface. By creating a 'buried channel'—a specific potential energy path deep inside the silicon—the device prevents charges from getting trapped by surface defects, which were a major problem in early chip designs. The device uses a series of electrode plates on the surface to pull these charges along this internal path, essentially acting like a bucket brigade for electrons. This allows for much faster and more reliable movement of data within the chip.

The gap

What does this patent NOT cover?

  • Does not cover charge-coupled devices that store or transfer charge directly on the semiconductor surface.
  • Does not cover memory structures that rely on traditional floating-gate transistors for long-term storage.
  • Does not cover devices lacking the specific ohmic contact means required to bias the storage medium for internal depletion.

These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.

Key facts

Patent numberUS 3792322
StatusExpired
FieldSemiconductors & Chips
AssigneeIndividual
InventorsG Smith, W Boyle
Filed1973
Granted1974
Expires1993 (expired)
Claims14
Times cited22
LitigationNone on record
Value · $16K$50KMinimal

What made this novel

Instead of fighting surface defects, the inventors moved the 'highway' for electrons into the bulk of the material, using an electrical bias to create a potential energy 'valley' that keeps charges safely away from the surface.

The Patent Drawing

Representative patent drawing for Buried channel charge coupled devices (US 3792322)
Representative figure · US 3792322All figures on Google Patents →
Buried channel charge coupled …(Primary claim)semiconductorsconsumer electronics

Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.

Where you've seen this

Real-world examples

01

Digital camera image sensors

02

Early digital video camcorders

03

High-speed analog signal delay lines

Why it matters

The bigger picture

This invention was critical for the evolution of digital imaging and high-speed signal processing. By solving the charge-trapping problem, it enabled the creation of high-quality Charge-Coupled Device (CCD) sensors, which became the standard for early digital cameras and video recorders. It essentially allowed engineers to build more reliable and sensitive silicon-based sensors.

Filed

April 19, 1973

Granted

February 12, 1974

Market context

Who's building on this

Companies in this space

The technology was pioneered at Bell Labs by Willard Boyle and George Smith, who later won the Nobel Prize for this work. Today, major semiconductor manufacturers and sensor companies like Sony, Samsung, and ON Semiconductor continue to refine the underlying physics of charge transfer in CMOS and CCD image sensors.

Market impact

This patent provided the technical foundation for the digital imaging revolution. It enabled the transition from analog film to digital sensors, eventually leading to the ubiquity of cameras in every smartphone and professional imaging system worldwide.

Claim 1 — Plain English

What this patent covers

This patent describes a way to move electrical charges through the middle of a semiconductor material rather than along its surface. By creating a 'buried channel'—a specific potential energy path deep inside the silicon—the device prevents charges from getting trapped by surface defects, which were a major problem in early chip designs. The device uses a series of electrode plates on the surface to pull these charges along this internal path, essentially acting like a bucket brigade for electrons. This allows for much faster and more reliable movement of data within the chip.

The clever bit

Instead of fighting surface defects, the inventors moved the 'highway' for electrons into the bulk of the material, using an electrical bias to create a potential energy 'valley' that keeps charges safely away from the surface.

What it does not cover

  • Does not cover charge-coupled devices that store or transfer charge directly on the semiconductor surface.
  • Does not cover memory structures that rely on traditional floating-gate transistors for long-term storage.
  • Does not cover devices lacking the specific ohmic contact means required to bias the storage medium for internal depletion.

Patent timeline

Filing

Application submitted to the patent office

Publication

Application published, typically 18 months after filing

Grant

Patent officially issued

Expiration

Patent enters public domain

This patent is in the public domain

See the Freedom to Build guide — what is free to use, what is not, and how to cite this patent.

View guide →

PatentBrief Score

Impact Score

Early stage

Citation count

27/40

Moderately cited

Claim breadth

9/20

Moderate scope

Recency

0/20

Older than 20 years

Assignee scale

0/20

Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →

PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.

Heuristic Value Estimate

What this patent might be worth

Minimal

$16K$50K

Midpoint $32K · expired or expiring · industry ×1.4

Adjust inputs →

Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.

Patent Claims

0 independent claims · 1 dependent

Claims are the legal boundaries of the patent. An independent claim stands alone. A dependent claim adds limitations to its parent, narrowing — but not broadening — the scope.

The original legal language

Original claims

14 claims as filed with the patent office.

Concepts involved

ClaimPrior artNon-obviousnessNoveltySpecificationAssigneePatent term

Citations

Patent lineage

Cites earlier patents

3

earlier patents this invention cites as foundations

View prior art →

Cited by later patents

22

later patents that build on this invention

View patents →

Cite this patent

Smith, G., & Boyle, W. (1974). How Buried Channel CCDs Move Data Deep Inside Silicon Chips (U.S. Patent No. 3,792,322). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/3792322/ccd-image-sensor

Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.

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Common Questions

Frequently Asked Questions

What does How Buried Channel CCDs Move Data Deep Inside Silicon Chips cover?

A foundational 1974 invention that improved how computer chips store and move electrical charges by keeping them away from messy surface defects.

Who owns patent US 3792322?

Individual owns this patent, granted in 1974.

When does this patent expire?

This patent has expired and is now in the public domain — anyone can use the invention freely.

What is patent US 3792322 cited by?

This patent has been cited by 22 later patents that build on its ideas.

What problem does this patent solve?

This invention was critical for the evolution of digital imaging and high-speed signal processing. By solving the charge-trapping problem, it enabled the creation of high-quality Charge-Coupled Device (CCD) sensors, which became the standard for early digital cameras and video recorders. It essentially allowed engineers to build more reliable and sensitive silicon-based sensors.

What does this patent NOT cover?

Does not cover charge-coupled devices that store or transfer charge directly on the semiconductor surface.

Same assignee

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Last reviewed: June 13, 2026 · PatentBrief is not a law firm and this is not legal advice.