Nanotubes for Better Cooling in Radio Frequency Chips
This patent describes a radio frequency device that uses tiny nanotube particles mixed into its protective casing to help the chip stay cooler and work better.
Original patent title: “RF devices with nanotube particles for enhanced performance and methods of forming the same”
This patent describes a radio frequency device that uses tiny nanotube particles mixed into its protective casing to help the chip stay cooler and work better. Granted in 2026.
Coverage
What does this patent actually cover?
This patent details a radio frequency (RF) device that improves heat management using nanotube particles. The device includes a main chip, called a 'mold device die,' which has an active layer where most of the work and heat generation occurs. This die is covered by a protective 'first mold compound.' Critically, tiny nanotube particles are spread throughout the bottom part of this mold compound, specifically over the active layer and isolation sections of the chip. These nanotubes have a higher thermal conductivity than the mold compound alone, meaning they are better at moving heat. By placing these nanotubes directly where heat is generated, they act like tiny heat highways, pulling heat away from the active circuits and helping the chip stay cooler. For example, a 5G modem chip could use this technology to prevent overheating, allowing it to maintain high performance during heavy data traffic.
The gap
What does this patent NOT cover?
- Does not cover devices using other high-thermal-conductivity particles, such as graphene flakes or metal powders, if they are not nanotubes.
- Does not cover cooling solutions where the nanotubes are not specifically dispersed within a mold compound, but perhaps in a different layer or structure.
- Does not cover devices where the nanotube particles are not located in the bottom portion of the mold compound or not positioned over the active layer.
- Does not cover devices that are not radio frequency devices, such as general-purpose processors or memory chips, unless they also incorporate RF functions.
- Does not cover cooling methods that rely solely on external heat sinks, fans, or liquid cooling systems, rather than internal mold compound enhancements.
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The clever part is precisely placing thermally conductive nanotube particles within the chip's protective mold compound, specifically over the hottest active layers. This turns the ordinary mold into an efficient heat-dissipating material right where it's needed most, without adding bulk or complex external cooling.
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
5G modems in smartphones
Wi-Fi 6/7 chips in routers and laptops
Automotive radar sensors
Satellite communication modules
High-frequency transceivers in base stations
Why it matters
The bigger picture
As radio frequency devices like those in smartphones and 5G base stations become smaller and more powerful, managing the heat they produce is critical. Overheating can slow down performance and shorten a device's life. This patent addresses this by improving how heat escapes from the chip's core, allowing for more compact and reliable RF systems.
Filed
February 1, 2024
Granted
September 15, 2026
Market context
Who's building on this
Companies in this space
Companies specializing in advanced semiconductor packaging and thermal management are likely exploring similar solutions. Major players like Amkor Technology, ASE Group, and Intel, along with material science companies such as DuPont and Sumitomo Bakelite, are continuously innovating in mold compounds and heat dissipation for high-performance chips.
Market impact
This technology could enable the development of smaller, more powerful, and more reliable radio frequency devices by significantly improving their internal heat dissipation. It may allow chip designers to push performance limits further, particularly in areas like 5G infrastructure, advanced automotive radar, and high-density wireless communication modules, where thermal constraints are a major design challenge.
Claim 1 — Plain English
What this patent covers
This patent details a radio frequency (RF) device that improves heat management using nanotube particles. The device includes a main chip, called a 'mold device die,' which has an active layer where most of the work and heat generation occurs. This die is covered by a protective 'first mold compound.' Critically, tiny nanotube particles are spread throughout the bottom part of this mold compound, specifically over the active layer and isolation sections of the chip. These nanotubes have a higher thermal conductivity than the mold compound alone, meaning they are better at moving heat. By placing these nanotubes directly where heat is generated, they act like tiny heat highways, pulling heat away from the active circuits and helping the chip stay cooler. For example, a 5G modem chip could use this technology to prevent overheating, allowing it to maintain high performance during heavy data traffic.
The clever bit
The clever part is precisely placing thermally conductive nanotube particles within the chip's protective mold compound, specifically over the hottest active layers. This turns the ordinary mold into an efficient heat-dissipating material right where it's needed most, without adding bulk or complex external cooling.
What it does not cover
- Does not cover devices using other high-thermal-conductivity particles, such as graphene flakes or metal powders, if they are not nanotubes.
- Does not cover cooling solutions where the nanotubes are not specifically dispersed within a mold compound, but perhaps in a different layer or structure.
- Does not cover devices where the nanotube particles are not located in the bottom portion of the mold compound or not positioned over the active layer.
- Does not cover devices that are not radio frequency devices, such as general-purpose processors or memory chips, unless they also incorporate RF functions.
- Does not cover cooling methods that rely solely on external heat sinks, fans, or liquid cooling systems, rather than internal mold compound enhancements.
Patent timeline
Application submitted to the patent office
Patent officially issued
PatentBrief Score
Impact Score
Early stage
Citation count
0/40
No citations yet
Claim breadth
0/20
Narrow claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →
Recency
20/20
Granted within 5 years
Assignee scale
0/20
Independent or smaller assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more →
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$17K – $54K
Midpoint $34K · 17.3 yr remaining · industry ×1.4
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Claim text not yet imported for this patent
Concepts involved
Cite this patent
(2026). Nanotubes for Better Cooling in Radio Frequency Chips (U.S. Patent No. 12,740,412). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/12740412/rf-devices-with-nanotube-particles-for-enhanced-performance-and-methods-of
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does Nanotubes for Better Cooling in Radio Frequency Chips cover?
This patent describes a radio frequency device that uses tiny nanotube particles mixed into its protective casing to help the chip stay cooler and work better.
When does this patent expire?
This patent is expected to expire on September 15, 2046, when the invention enters the public domain.
What problem does this patent solve?
As radio frequency devices like those in smartphones and 5G base stations become smaller and more powerful, managing the heat they produce is critical. Overheating can slow down performance and shorten a device's life. This patent addresses this by improving how heat escapes from the chip's core, allowing for more compact and reliable RF systems.
What does this patent NOT cover?
Does not cover devices using other high-thermal-conductivity particles, such as graphene flakes or metal powders, if they are not nanotubes.
Patent monitoring