How Intel's Transceiver Chip Manages Wireless Signals
Intel's 2024 patent describes a transceiver chip with patch antennas on one side and an RFIC with a protective shield on the other, designed to improve wireless communication by managing interference.
Original patent title: “Wireless communication technology, apparatuses, and methods”
Intel's 2024 patent describes a transceiver chip with patch antennas on one side and an RFIC with a protective shield on the other, designed to improve wireless communication by managing interference. Granted to Intel in 2024 with 26 claims and 5 forward citations, and it is expected to expire in 2042.
Coverage
What does this patent actually cover?
This patent details a transceiver, which is a device that can both send and receive radio signals. It features multiple patch antennas on one side of a substrate (think of it like a circuit board). On the other side, there's a radio frequency integrated circuit (RFIC) that handles the signals. Crucially, a shield is placed on the same side as the RFIC to block unwanted radio and electromagnetic interference, ensuring cleaner signals. The patent also describes how connection layers within the substrate link the antennas to the RFIC, and mentions features like dual-polarized antennas and parasitic elements for better signal reception and transmission. For example, ClaimclaimA numbered sentence at the end of a patent that legally defines what the inventor owns. The most important section.Read more → 14 suggests this could be used with a touchscreen and signal processor to generate output signals for transmission based on user input.
The gap
What does this patent NOT cover?
- Transceivers where the antennas and the RFIC are not on opposite sides of the substrate.
- Systems that do not use patch antennas.
- Transceivers that lack a shield to protect the RFIC from interference.
- Devices where the RFIC is not coupled to the antennas via redistribution layers within the substrate.
- Systems that do not involve downconverting RF signals to baseband signals.
These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.
Key facts
What made this novel
The key innovation lies in the specific physical arrangement: placing the patch antennas on one surface of the substrate and the RFIC with its protective shield on the opposite surface, connected internally. This design aims to optimize signal integrity by isolating the sensitive RF components from interference while maintaining a compact form factor.
The Patent Drawing
Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.
Where you've seen this
Real-world examples
5G base stations
Advanced Wi-Fi routers
Wireless communication modules for devices
Why it matters
The bigger picture
This patent is part of Intel's ongoing work in advancing wireless communication technologies, particularly for high-frequency bands like millimeter wave (mmWave) used in 5G and future wireless standards. Innovations in transceiver design are critical for enabling faster, more reliable wireless connections in everything from smartphones to advanced networking equipment.
Filed
December 27, 2022
Granted
April 9, 2024
Market context
Who's building on this
Companies in this space
Intel, the assigneeassigneeThe entity that owns the patent — usually the inventor's employer or a company.Read more → and likely developer of this technology, is a major player in semiconductor design and wireless communication chips. Companies involved in 5G infrastructure and advanced wireless networking equipment would also be interested in such transceiver architectures.
Market impact
This patent contributes to the development of more efficient and robust wireless communication systems. By addressing signal integrity and interference issues in transceiver design, it supports the evolution towards higher bandwidth and lower latency wireless services, impacting the performance and capabilities of next-generation mobile and networking devices.
Claim 1 — Plain English
What this patent covers
This patent details a transceiver, which is a device that can both send and receive radio signals. It features multiple patch antennas on one side of a substrate (think of it like a circuit board). On the other side, there's a radio frequency integrated circuit (RFIC) that handles the signals. Crucially, a shield is placed on the same side as the RFIC to block unwanted radio and electromagnetic interference, ensuring cleaner signals. The patent also describes how connection layers within the substrate link the antennas to the RFIC, and mentions features like dual-polarized antennas and parasitic elements for better signal reception and transmission. For example, Claim 14 suggests this could be used with a touchscreen and signal processor to generate output signals for transmission based on user input.
The clever bit
The key innovation lies in the specific physical arrangement: placing the patch antennas on one surface of the substrate and the RFIC with its protective shield on the opposite surface, connected internally. This design aims to optimize signal integrity by isolating the sensitive RF components from interference while maintaining a compact form factor.
What it does not cover
- Transceivers where the antennas and the RFIC are not on opposite sides of the substrate.
- Systems that do not use patch antennas.
- Transceivers that lack a shield to protect the RFIC from interference.
- Devices where the RFIC is not coupled to the antennas via redistribution layers within the substrate.
- Systems that do not involve downconverting RF signals to baseband signals.
Patent timeline
Application submitted to the patent office
Application published, typically 18 months after filing
Patent officially issued
Patent enters public domain
PatentBrief Score
Impact Score
Strong
Citation count
16/40
Early citations
Claim breadth
17/20
Very broad protection
Recency
20/20
Granted within 5 years
Assignee scale
20/20
Major company or institution
PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.
Heuristic Value Estimate
What this patent might be worth
$82K – $262K
Midpoint $164K · 16.2 yr remaining · industry ×1.4
Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.
Claim text not yet imported for this patent
The original legal language
Original claims
26 claims as filed with the patent office.
Concepts involved
Citations
Patent lineage
Cite this patent
Nikopour, H., Orhan, O., Talwar, S., Alpman, E., Amadjikpe, A. L., Asaf, O., Azadet, K., Banin, R., Baryakh, M., Bazov, A., Brenna, S., Casper, B. K., Chakrabarti, A., Chance, G., Choudhury, D., Cohen, E., Silva, C. D., Dalmia, S., Asl, S. D., ..., & Kitchin, D. (2024). How Intel's Transceiver Chip Manages Wireless Signals (U.S. Patent No. 11,955,732). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/11955732/wireless-communication-technology-apparatuses-and-methods
Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.
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Common Questions
Frequently Asked Questions
What does How Intel's Transceiver Chip Manages Wireless Signals cover?
Intel's 2024 patent describes a transceiver chip with patch antennas on one side and an RFIC with a protective shield on the other, designed to improve wireless communication by managing interference.
Who owns patent US 11955732?
Intel owns this patent, granted in 2024.
When does this patent expire?
This patent is expected to expire on December 27, 2042, when the invention enters the public domain.
What is patent US 11955732 cited by?
This patent has been cited by 5 later patents that build on its ideas.
What problem does this patent solve?
This patent is part of Intel's ongoing work in advancing wireless communication technologies, particularly for high-frequency bands like millimeter wave (mmWave) used in 5G and future wireless standards. Innovations in transceiver design are critical for enabling faster, more reliable wireless connections in everything from smartphones to advanced networking equipment.
What does this patent NOT cover?
Transceivers where the antennas and the RFIC are not on opposite sides of the substrate.
Same assignee
More from Intel
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