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How Apple Embeds Haptic Actuators Directly Into Device Layers

A design for touchscreens that embeds vibration-producing actuators directly into a nonconductive material layer, paired with force sensors to detect how hard a user presses.

Granted 2018ActiveExpires 2030Owned by Apple IncInvented by Michael Pilliod, Paul G. Puskarich

Original patent title: “Touch-based user interface with haptic feedback

Plain-English explanation by SahiLast reviewed · June 15, 2026

A design for touchscreens that embeds vibration-producing actuators directly into a nonconductive material layer, paired with force sensors to detect how hard a user presses. Granted to Apple Inc in 2018 with 23 claims and 18 forward citations.

Key facts

Patent numberUS 10013058
StatusActive
FieldConsumer Electronics
AssigneeApple Inc
InventorsMichael Pilliod, Paul G. Puskarich
Filed2010
Granted2018
Claims23
Times cited18
LitigationNone on record
Value · $164K$524KModest

Coverage

What does this patent actually cover?

This patent describes a way to build a touch interface where haptic actuators—the parts that make your phone vibrate or click—are physically embedded inside a nonconductive material layer. By placing a printed circuit board (PCB) between this haptic layer and force sensors, the device can effectively separate the vibration mechanism from the pressure-sensing mechanism. This allows the device to provide tactile feedback while simultaneously measuring the intensity of a user's touch. For example, a screen could feel like a physical button by vibrating when pressed, while the sensors determine if the user performed a light tap or a deep press.

The gap

What does this patent NOT cover?

  • Does not cover haptic systems that use external vibration motors attached to the device chassis rather than embedded in the interface layer.
  • Does not cover software-based haptic simulations that rely solely on screen animations without physical actuators.
  • Does not cover touch interfaces that lack force-sensing capabilities.
  • Does not cover systems where the actuators are not embedded within a nonconductive material layer.

These exclusions are unique to PatentBrief — derived from the actual claim language, not patent-office boilerplate.

What made this novel

The innovation lies in embedding the actuators directly into a rigid nonconductive material that acts as a structural layer, rather than just mounting them to the back of a screen, which allows for more precise and localized haptic feedback.

Touch-based user interface wit…(Primary claim)consumer electronicsmechanicalsemiconductors

Schematic visualization of the patent's claim structure. Hand-drawn diagrams in progress for each landmark patent.

Where you've seen this

Real-world examples

01

iPhone 7 and 8 Home buttons

02

Apple Watch Force Touch screens

03

MacBook Force Touch trackpads

Why it matters

The bigger picture

This technology is central to the 'Taptic Engine' and Force Touch features seen in Apple's modern hardware. It allowed for the removal of physical moving buttons, such as the home button on the iPhone 7, by creating a convincing illusion of a click through precise, localized vibration.

Filed

September 21, 2010

Granted

July 3, 2018

Market context

Who's building on this

Companies in this space

Apple remains the primary user of this specific integrated haptic architecture. Other companies in the smartphone and laptop industry, such as Samsung and various high-end PC manufacturers, continue to develop competing haptic feedback systems, though they often use different mechanical arrangements for their vibration modules.

Market impact

This patent helped enable the transition from mechanical buttons to solid-state interfaces in consumer electronics. By providing a reliable way to simulate physical feedback, it allowed manufacturers to create more durable, water-resistant devices with fewer moving parts, setting a new standard for user interface expectations.

Claim 1 — Plain English

What this patent covers

This patent describes a way to build a touch interface where haptic actuators—the parts that make your phone vibrate or click—are physically embedded inside a nonconductive material layer. By placing a printed circuit board (PCB) between this haptic layer and force sensors, the device can effectively separate the vibration mechanism from the pressure-sensing mechanism. This allows the device to provide tactile feedback while simultaneously measuring the intensity of a user's touch. For example, a screen could feel like a physical button by vibrating when pressed, while the sensors determine if the user performed a light tap or a deep press.

The clever bit

The innovation lies in embedding the actuators directly into a rigid nonconductive material that acts as a structural layer, rather than just mounting them to the back of a screen, which allows for more precise and localized haptic feedback.

What it does not cover

  • Does not cover haptic systems that use external vibration motors attached to the device chassis rather than embedded in the interface layer.
  • Does not cover software-based haptic simulations that rely solely on screen animations without physical actuators.
  • Does not cover touch interfaces that lack force-sensing capabilities.
  • Does not cover systems where the actuators are not embedded within a nonconductive material layer.

Patent timeline

Filing

Application submitted to the patent office

Publication

Application published, typically 18 months after filing

Grant

Patent officially issued

PatentBrief Score

Impact Score

Strong

Citation count

26/40

Moderately cited

Claim breadth

15/20

Broad claimsclaimsThe numbered statements at the end of a patent that legally define what the inventor owns.Read more →

Recency

10/20

Granted 5–10 years ago

Assignee scale

20/20

Major company or institution

PatentBrief Impact Score — based on citation count, claim breadth, recency, and assignee scale. Not a legal assessment.

Heuristic Value Estimate

What this patent might be worth

Modest

$164K$524K

Midpoint $328K · 4.3 yr remaining · industry ×1.6

Adjust inputs →

Heuristic only — blends forward/backward citation counts, claim scope, time remaining, litigation history, and CPC-derived industry baseline. Real valuations need a professional appraisal.

The original legal language

Original claims

23 claims as filed with the patent office.

Concepts involved

ClaimPrior artNon-obviousnessNoveltySpecificationAssigneePatent term

Citations

Patent lineage

Cites earlier patents

473

earlier patents this invention cites as foundations

View prior art →

Cited by later patents

18

later patents that build on this invention

View patents →

Cite this patent

Pilliod, M., & Puskarich, P. G. (2018). How Apple Embeds Haptic Actuators Directly Into Device Layers (U.S. Patent No. 10,013,058). U.S. Patent and Trademark Office. https://patentbrief.org/patent/us/10013058/face-id

Auto-generated from the patent record. Double-check author order and the issue date against the official USPTO document before submitting.

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Common Questions

Frequently Asked Questions

What does How Apple Embeds Haptic Actuators Directly Into Device Layers cover?

A design for touchscreens that embeds vibration-producing actuators directly into a nonconductive material layer, paired with force sensors to detect how hard a user presses.

Who owns patent US 10013058?

Apple Inc owns this patent, granted in 2018.

When does this patent expire?

This patent is expected to expire on July 3, 2038, when the invention enters the public domain.

What is patent US 10013058 cited by?

This patent has been cited by 18 later patents that build on its ideas.

What problem does this patent solve?

This technology is central to the 'Taptic Engine' and Force Touch features seen in Apple's modern hardware. It allowed for the removal of physical moving buttons, such as the home button on the iPhone 7, by creating a convincing illusion of a click through precise, localized vibration.

What does this patent NOT cover?

Does not cover haptic systems that use external vibration motors attached to the device chassis rather than embedded in the interface layer.

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Last reviewed: June 15, 2026 · PatentBrief is not a law firm and this is not legal advice.