Taiwan Semiconductor Manufacturing Co TSMC

Stacking Chips with Light-Guiding Plastic Wires

TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication.

How to Stack Two Computer Chips with Direct Connections

TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.

Making Tiny Chip Patterns Using Gas and Light

This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips.

How to Clean Metal Off Wafers After EUV Chipmaking

This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips.