PatentBrief

Inventor

Shin-puu Jeng

Patents indexed

1

Year range

2016

Associated with

Years active

2016

Total patents

1

Most recent

2016

Frequent collaborator

Shang-Yun Hou

Domains

semiconductorsconsumer_electronicstelecommunicationssoftwareai_ml

Activity by decade

2010s
1

Patents

1

Career timeline

1 patents, in 2016

Dot size = forward citations

20162017

Hover or tap any dot to see the patent. Larger dots indicate more forward citations — a proxy for downstream influence.

US 9412678·2016·Taiwan Semiconductor Manufacturing Co TSMC

How to Stack Two Computer Chips with Direct Connections

TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.

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