How to Embed Tiny Optical Components Directly into Circuit Boards
A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient.
Patent Number
US RE50510
Status
Active
Filing Date
April 26, 2021
Grant Date
July 29, 2025
Expiration
~April 2041 (estimated)
Claims
62
Assignee
Sony Group Corp
Inventors
Terukazu Naruse, Takahiro Arakida
Citations
0 forward · 20 backward
What it covers
This patent describes a way to carve a hole, or recessed part, into a multilayer circuit board to create a home for optical parts like lasers or sensors. By cutting through the top insulating layers to reach internal wiring patterns, the design allows the optical element to sit flush within the board itself. An optical waveguide—a tiny pipe for light—is also placed in this hole to direct light along the surface of the board. This setup creates a direct, compact connection between the electrical circuits and the optical components, which is useful for high-speed data transmission or sensing.
What it doesn't cover
- —Does not cover optical devices that sit on top of a circuit board without being recessed into the layers.
- —Does not cover standard fiber optic cables that are not integrated into the board's recessed structure.
- —Does not cover light-emitting components that lack an electrical connection to the internal wiring patterns of the multilayer substrate.
The clever bit
The innovation is using the circuit board's own internal wiring layers as the mounting and electrical interface for the optical component, effectively turning the board into a structural housing for the light path.
Why it matters
As electronics shrink, the bottleneck often becomes how to move data quickly between chips. By integrating light-based components directly into the circuit board, companies like Sony can reduce the physical space required for optical communication, potentially leading to faster and more compact hardware for data centers or mobile devices.
Real-world examples
- 1.High-speed optical transceivers
- 2.Compact laser-based sensors for mobile devices
- 3.Integrated photonic circuit boards
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US RE50510 · 2026