US 8310051
Prior Art
How Chips Are Stacked and Wired in Tiny Phone Parts
Patents that US 8310051 cites as prior art — the earlier inventions that this patent builds upon or distinguishes itself from.
CITED PATENTS
48
IN PATENTLENS
0
Citation data
This patent cites 48 prior patents. Citation detail pages are being built out in Phase 2.
Prior art citations are sourced from the USPTO patent database. Only patents indexed in PatentBrief are shown as links — others are recorded by number only.