US 8310051
Forward Citations
How Chips Are Stacked and Wired in Tiny Phone Parts
Patents that cite US 8310051 — inventions that reference this patent as foundational prior art in their own applications. High forward citation counts indicate an influential patent.
CITED BY
14 patents
IN PATENTLENS
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Citation network
This patent has been cited by 14 later patents. Citation detail pages are being built out in Phase 2.
Forward citation data is sourced from the USPTO patent database. Only patents indexed in PatentBrief are shown as links.