Making Tiny Chip Patterns Using Gas and Light
This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips.
Patent Number
US 10514610
Status
Active
Filing Date
July 9, 2018
Grant Date
December 24, 2019
Expiration
July 9, 2038
Claims
23
Assignee
Taiwan Semiconductor Manufacturing Co TSMC
Inventors
Kevin Huang, Jeng-Horng Chen, Kuo-Chang Kau, Shu-Hao Chang
Citations
0 forward · 39 backward
What it covers
This patent describes an apparatus for creating patterns on semiconductor wafers using a gas-phase resist. Instead of coating a liquid resist, the machine flows an organic gas near the wafer's surface (Claim 1). A radiation source, often extreme ultraviolet (EUV) light (Claim 11), shines a patterned beam onto a special 'deposition enhancement layer' (DEL) on the wafer (Claim 1). Where the light hits, elements of the organic gas polymerize, meaning they stick together and form a solid resist pattern (Claim 1). The apparatus precisely controls the gas flow, turning it on while the light scans and shutting it off before the light reaches the edge of the wafer (Claim 1). For example, to create a circuit line, the EUV light would draw the line, and the organic gas would solidify only where the light hits, forming the resist pattern.
What it doesn't cover
- —Does not cover traditional lithography methods that use liquid photoresists applied by spinning the wafer.
- —Does not cover patterning techniques that do not involve the polymerization of an organic gas by patterned radiation.
- —Does not cover systems where the organic gas flow is not precisely controlled to shut off before the radiation reaches the wafer's edge (Claim 1).
- —Does not cover apparatuses that do not include a deposition enhancement layer (DEL) on the substrate (Claim 1).
- —Does not cover patterning methods that do not use a radiation source to directly polymerize gas elements into a resist pattern.
The clever bit
The clever part is forming the resist pattern directly from a gas in a highly controlled manner, rather than applying a liquid. This allows for much finer patterns and avoids issues like resist collapse or defects that can occur with liquid resists, especially when using extreme ultraviolet light.
Why it matters
This technology is crucial for manufacturing the smallest, most advanced computer chips. As chips get smaller, traditional liquid resists struggle to create the necessary fine patterns. Gas-phase resists, especially with EUV light, offer a way to overcome these limitations, enabling the production of faster, more powerful processors and memory for all our electronic devices.
Real-world examples
- 1.Advanced semiconductor manufacturing facilities (fabs)
- 2.EUV lithography machines for 3nm and 2nm process nodes
- 3.Next-generation memory chip production
- 4.High-performance processor manufacturing
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