US 10181457
Forward Citations
How a Fan-Out Chip Package Connects Multiple Chips on a Metal Substrate
Patents that cite US 10181457 — inventions that reference this patent as foundational prior art in their own applications. High forward citation counts indicate an influential patent.
CITED BY
13 patents
IN PATENTLENS
0
Citation network
This patent has been cited by 13 later patents. Citation detail pages are being built out in Phase 2.
Forward citation data is sourced from the USPTO patent database. Only patents indexed in PatentBrief are shown as links.