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US 9412678

How to Stack Two Computer Chips with Direct Connections

TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, ofte…

Statusactive

Granted2016

Expires2035

Claims23

Forward citations1

Prior art6

AssigneeTaiwan Semiconductor Manufacturing Co TSMC

InventorsChen-Hua Yu, Der-Chyang Yeh +2

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