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US 12181722

Stacking Chips with Light-Guiding Plastic Wires

TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribut…

Statusactive

Granted2024

Expires2043

Claims23

Forward citations0

Prior art15

AssigneeTaiwan Semiconductor Manufacturing Co TSMC

InventorsChien-Te Wu, Chung-Ming Weng +3

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