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Invensas

Patents indexed

Year range

2019

semiconductorsconsumer_electronicstelecommunicationsautomotive

Key Inventors

Rajesh Katkar1 Ashok S. Prabhu1

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1 patents, in 2019

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2019 — How a Fan-Out Chip Package Connects Multiple Chips on a Metal Substrate

US 10181457·2019

How a Fan-Out Chip Package Connects Multiple Chips on a Metal Substrate

This patent describes a way to stack and connect multiple tiny computer chips using a metal base, allowing more connections to spread out from the chip.

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Invensas

1 patents, in 2019

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