US RE48450
Prior Art
How to Use Air-Gaps to Insulate High-Voltage Semiconductor Chips
Patents that US RE48450 cites as prior art — the earlier inventions that this patent builds upon or distinguishes itself from.
CITED PATENTS
33
IN PATENTLENS
0
Citation data
This patent cites 33 prior patents. Citation detail pages are being built out in Phase 2.
Prior art citations are sourced from the USPTO patent database. Only patents indexed in PatentBrief are shown as links — others are recorded by number only.