Flexible Silicon Chips That Send Data Using Light

This patent describes a flexible silicon chip that uses light to send data between different parts of a computer, making connections faster and potentially more compact.

What it covers

This patent describes a silicon photonic interconnect built on a silicon on insulator (SOI) substrate. It includes a waveguide, a tiny path for light, that has a specific 'first optical mode' (Claim 1). This interconnect is designed to exchange optical data with an integrated circuit (IC) through a 'coupling region' (Claim 1). A key feature is that this coupling region has a 'second optical mode larger than the first optical mode' (Claim 1), which helps light transfer efficiently. The interconnect can be made 'flexible' by adding a 'polymer layer' on the SOI substrate (Claim 2). It can connect to the IC using methods like 'evanescent coupling' (Claim 3), an 'optical grating' (Claim 4), or an 'etched taper' (Claim 5). It can also connect to external 'optical fiber connections' through a 'fiber coupling region' (Claim 7), which might use 'v-grooves' for alignment (Claim 8) or 'vertical couplers' to redirect light (Claim 9). For example, this technology could be used to create flexible optical cables that connect different processing units within a data center rack, replacing traditional electrical wires for higher speed.

What it doesn't cover

• —Does not cover purely electrical interconnects that do not exchange 'optical data' (Claim 1).
• —Does not cover silicon photonic interconnects where the coupling region's optical mode is not larger than the SOI waveguide's optical mode (Claim 1).
• —Does not cover photonic interconnects built on substrates other than 'silicon on insulator (SOI)' (Claim 1).
• —Does not cover optical coupling to components that are not 'integrated circuits' or 'optical fiber connections' as described (Claims 1, 7).
• —Does not cover systems where the silicon photonic interconnect lacks a waveguide with a first optical mode (Claim 1).

The clever bit

The novelty lies in combining silicon photonics on an SOI substrate with a specific design for the coupling region, which has an optical mode larger than the waveguide it connects to (Claim 1). This 'mode matching' helps efficiently transfer light between the tiny on-chip waveguide and the larger components it connects to, minimizing signal loss. The optional flexible polymer layer (Claim 2) also offers a practical advantage for integration and packaging.

Why it matters

Traditional electrical connections struggle to keep up with the increasing demand for high-speed data transfer over short distances due to signal loss and interference. Optical interconnects, which use light instead of electricity, can carry much more data faster and with less power. This patent aims to make these optical connections more practical by integrating them directly with silicon chips and adding flexibility, which is crucial for compact packaging and efficient routing in modern electronics and data centers.

Real-world examples

• 1.Optical transceivers in data centers
• 2.High-performance computing interconnects
• 3.Chip-to-chip optical links
• 4.Fiber optic communication modules