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US RE42346

How Silicon Microphones Use Layers to Shrink Sound Sensors

A design for a tiny, silicon-based microphone that stacks a sound-sensing chip and an electronic processor chip together with an intermediate layer to save space.

Statusactive

Granted2011

Expires2022

Claims18

Forward citations4

Prior art27

AssigneeEpcos Pte Ltd

InventorsHenrick Laurids Hvims, Maja Amskov Gravad +5

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