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US 20250172879

How to Clean Metal Off Wafers After EUV Chipmaking

This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet li…

Statusactive

Granted—

Expires2045

Claims23

Forward citations0

Prior art0

AssigneeTaiwan Semiconductor Manufacturing Co TSMC

InventorsJoy Cheng, Ching-Yu Chang +1

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