# How to Embed Tiny Optical Components Directly into Circuit Boards > A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient. - **Patent:** US RE50510 - **Original title:** USRE50510E1 - Optical device - **Owner:** Sony Group Corp - **Granted:** 2025 - **Status:** Active - **Times cited:** 0 - **Field:** consumer_electronics, semiconductors, telecommunications ## What it does This patent describes a way to carve a hole, or recessed part, into a multilayer circuit board to create a home for optical parts like lasers or sensors. By cutting through the top insulating layers to reach internal wiring patterns, the design allows the optical element to sit flush within the board itself. An optical waveguide—a tiny pipe for light—is also placed in this hole to direct light along the surface of the board. This setup creates a direct, compact connection between the electrical circuits and the optical components, which is useful for high-speed data transmission or sensing. ## What it does NOT cover - Does not cover optical devices that sit on top of a circuit board without being recessed into the layers. - Does not cover standard fiber optic cables that are not integrated into the board's recessed structure. - Does not cover light-emitting components that lack an electrical connection to the internal wiring patterns of the multilayer substrate. ## The clever bit The innovation is using the circuit board's own internal wiring layers as the mounting and electrical interface for the optical component, effectively turning the board into a structural housing for the light path. ## Real-world examples 1. High-speed optical transceivers 2. Compact laser-based sensors for mobile devices 3. Integrated photonic circuit boards ## Why it matters As electronics shrink, the bottleneck often becomes how to move data quickly between chips. By integrating light-based components directly into the circuit board, companies like Sony can reduce the physical space required for optical communication, potentially leading to faster and more compact hardware for data centers or mobile devices. ## Frequently asked questions ### What does How to Embed Tiny Optical Components Directly into Circuit Boards cover? A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient. ### Who owns patent US RE50510? Sony Group Corp owns this patent, granted in 2025. ### When does this patent expire? This patent is expected to expire on July 29, 2045, when the invention enters the public domain. ### What problem does this patent solve? As electronics shrink, the bottleneck often becomes how to move data quickly between chips. By integrating light-based components directly into the circuit board, companies like Sony can reduce the physical space required for optical communication, potentially leading to faster and more compact hardware for data centers or mobile devices. ### What does this patent NOT cover? Does not cover optical devices that sit on top of a circuit board without being recessed into the layers. **Full plain-English explainer:** https://patentbrief.org/patent/us/RE50510/gemini-bard **Original patent:** https://patents.google.com/patent/USRE50510 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [Attaching Flexible Circuits with Light Sensors to a Chip](https://patentbrief.org/patent/us/9055681/method-for-attaching-a-flexible-structure-to-a-device-and-a-device-having-a-flex) — This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication. - [How TSMC Makes Advanced Silicon-Based Light Sensors](https://patentbrief.org/patent/us/12310123/raptor-1) — A manufacturing process for high-performance light sensors that use alternating doped regions within a silicon-on-insulator structure to improve detection efficiency. - [How Rohm Designs Compact Semiconductor Packages for Better Heat Management](https://patentbrief.org/patent/us/RE49912/rotomolded-cooler) — A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices.