{
  "patent_number": "US RE50510",
  "country": "US",
  "title": "How to Embed Tiny Optical Components Directly into Circuit Boards",
  "original_title": "USRE50510E1 - Optical device",
  "summary": "A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient.",
  "what_it_does": "This patent describes a way to carve a hole, or recessed part, into a multilayer circuit board to create a home for optical parts like lasers or sensors. By cutting through the top insulating layers to reach internal wiring patterns, the design allows the optical element to sit flush within the board itself. An optical waveguide—a tiny pipe for light—is also placed in this hole to direct light along the surface of the board. This setup creates a direct, compact connection between the electrical circuits and the optical components, which is useful for high-speed data transmission or sensing.",
  "what_it_does_not_cover": [
    "Does not cover optical devices that sit on top of a circuit board without being recessed into the layers.",
    "Does not cover standard fiber optic cables that are not integrated into the board's recessed structure.",
    "Does not cover light-emitting components that lack an electrical connection to the internal wiring patterns of the multilayer substrate."
  ],
  "filed": "2021-04-26",
  "granted": "2025-07-29",
  "expires": null,
  "status": "active",
  "holder": "Sony Group Corp",
  "holder_url": "https://patentbrief.org/company/sony-group-corp",
  "inventors": [
    {
      "name": "Terukazu Naruse",
      "url": "https://patentbrief.org/inventor/terukazu-naruse"
    },
    {
      "name": "Takahiro Arakida",
      "url": "https://patentbrief.org/inventor/takahiro-arakida"
    }
  ],
  "times_cited": 0,
  "tags": [
    "consumer_electronics",
    "semiconductors",
    "telecommunications"
  ],
  "abstract": "An optical device includes: a multilayer structure substrate on which plural insulating layers are stacked and a wiring pattern is formed between layers; a recessed part for exposing the wiring pattern between the layers by cutting off a part of the multilayer structure substrate; an optical element mounted within the recessed part in electric conduction to the wiring pattern exposed by the recessed part; and an optical waveguide member forming an optical path for the optical element and guiding light along a surface of the multilayer structure substrate.",
  "url": "https://patentbrief.org/patent/us/RE50510/gemini-bard",
  "markdown_url": "https://patentbrief.org/patent/us/RE50510/gemini-bard/md",
  "google_patents_url": "https://patents.google.com/patent/USRE50510",
  "relatedPatents": []
}