{
  "patent_number": "US RE49912",
  "country": "US",
  "title": "How Rohm Designs Compact Semiconductor Packages for Better Heat Management",
  "original_title": "USRE49912E1 - Semiconductor device",
  "summary": "A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices.",
  "what_it_does": "This patent describes a specific physical layout for a semiconductor package containing multiple chips and driving circuits. It uses a series of island parts (which act as mounting bases) and lead terminals (the metal pins that connect the chip to a circuit board) arranged in a precise geometric pattern. By varying the lengths, widths, and heights of these terminals and their connections, the design manages how heat is dissipated and how electrical signals are routed within the resin-encapsulated package. A key feature is the inclusion of a recess in the resin that allows for a heat radiation layer to directly contact or sit near the mounting islands, improving thermal efficiency.",
  "what_it_does_not_cover": [
    "Does not cover general semiconductor chip manufacturing or the internal logic of the chips themselves.",
    "Does not cover packaging designs that lack the specific multi-island and multi-terminal arrangement described in claim 1.",
    "Does not cover cooling systems that rely exclusively on external fans or liquid cooling rather than the integrated heat radiation layer.",
    "Does not cover packaging that uses non-resin encapsulation materials."
  ],
  "filed": "2021-06-28",
  "granted": "2024-04-09",
  "expires": null,
  "status": "active",
  "holder": "Rohm Co Ltd",
  "holder_url": "https://patentbrief.org/company/rohm-co-ltd",
  "inventors": [
    {
      "name": "Akihiro Kimura",
      "url": "https://patentbrief.org/inventor/akihiro-kimura"
    }
  ],
  "times_cited": 0,
  "tags": [
    "semiconductors",
    "consumer_electronics",
    "automotive"
  ],
  "abstract": "A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.",
  "url": "https://patentbrief.org/patent/us/RE49912/rotomolded-cooler",
  "markdown_url": "https://patentbrief.org/patent/us/RE49912/rotomolded-cooler/md",
  "google_patents_url": "https://patents.google.com/patent/USRE49912",
  "relatedPatents": []
}