# Attaching Flexible Circuits with Light Sensors to a Chip > This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part. - **Patent:** US 9055681 - **Original title:** Method for attaching a flexible structure to a device and a device having a flexible structure - **Owner:** International Business Machines - **Granted:** 2015 - **Status:** Active - **Times cited:** 0 - **Field:** consumer_electronics, semiconductors, telecommunications, materials, biotech ## What it does The patent describes a device where a bendable component, called a "flexible structure" (Claim 1), is precisely connected to a main "processed substrate" (like a computer chip) using a "patterned bonding layer" (Claim 1). This flexible structure contains special light-sensitive or light-emitting parts, known as "optoelectronic elements," which are connected to "contact elements" on the flexible material. A key feature is a "via," which is a carefully placed hole that goes through both the main substrate and the flexible structure. This via allows light to either enter or exit the optoelectronic element (Claim 1). For example, this could be used to connect a flexible optical sensor to a rigid processor chip, where the sensor needs to receive light from underneath the chip. ## What it does NOT cover - Devices where the flexible structure does not extend beyond the main substrate (Claim 1). - Devices without a "via" (a hole) that passes through both the substrate and the flexible structure (Claim 1). - Devices where the optoelectronic element is not specifically arranged to transmit or receive light through the via (Claim 1). - Attachment methods that do not use a "patterned bonding layer" between the substrate and the flexible structure (Claim 1). - Devices where the flexible structure does not include a contact element for the optoelectronic element (Claim 1). ## The clever bit The clever part is the precise method of attaching a pre-fabricated flexible circuit, which already contains optoelectronic elements, onto a rigid substrate. This process ensures accurate alignment of a light-guiding hole (via) through both layers, using a patterned adhesive layer for a robust and functional optical and electrical connection. ## Real-world examples 1. Flexible displays with integrated sensors 2. Wearable health monitors with optical sensing 3. Compact optical interconnects for data centers 4. Miniaturized medical implants with light-based diagnostics 5. Augmented reality glasses components ## Why it matters This technology is important for creating compact, high-performance devices that combine rigid electronics with flexible components, especially for optical communication or sensing. It allows for advanced packaging where light signals can be routed directly to or from flexible circuits, which is crucial for miniaturization and new form factors in electronics. This integration can lead to more versatile and smaller devices in various applications. ## Frequently asked questions ### What does Attaching Flexible Circuits with Light Sensors to a Chip cover? This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part. ### Who owns patent US 9055681? International Business Machines owns this patent, granted in 2015. ### When does this patent expire? This patent is expected to expire on July 15, 2032, when the invention enters the public domain. ### What problem does this patent solve? This technology is important for creating compact, high-performance devices that combine rigid electronics with flexible components, especially for optical communication or sensing. It allows for advanced packaging where light signals can be routed directly to or from flexible circuits, which is crucial for miniaturization and new form factors in electronics. This integration can lead to more versatile and smaller devices in various applications. ### What does this patent NOT cover? Devices where the flexible structure does not extend beyond the main substrate (Claim 1). **Full plain-English explainer:** https://patentbrief.org/patent/us/9055681/method-for-attaching-a-flexible-structure-to-a-device-and-a-device-having-a-flex **Original patent:** https://patents.google.com/patent/US9055681 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [How to Embed Tiny Optical Components Directly into Circuit Boards](https://patentbrief.org/patent/us/RE50510/gemini-bard) — A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient. - [How to Stack Computer Chips on a Wafer for Smaller Devices](https://patentbrief.org/patent/us/7824959/wafer-level-stack-structure-for-system-in-package-and-method-thereof) — This patent describes a method for stacking two full wafers of computer chips, where the chips on each wafer are roughly the same overall size but have different active areas, to create a compact system-in-package. - [Combining Sealed and Exposed Sensors on One Microchip](https://patentbrief.org/patent/us/8387464/laterally-integrated-mems-sensor-device-with-multi-stimulus-sensing) — This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication.