{
  "patent_number": "US 8387464",
  "country": "US",
  "title": "Combining Sealed and Exposed Sensors on One Microchip",
  "original_title": "Laterally integrated MEMS sensor device with multi-stimulus sensing",
  "summary": "This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap.",
  "what_it_does": "This patent describes a microelectromechanical systems (MEMS) sensor device that integrates multiple sensors on a single chip. It includes a substrate with a 'first side' and an opposing 'second side' (claim 1). A 'first sensor' and a 'second sensor' are both placed on the 'first side' of this substrate, at different locations (claim 1). The 'second sensor' contains a 'sense element' (claim 1), which is the part that detects physical changes. A key feature is a 'cavity' that extends through the substrate from the 'second side' (the back) to expose this 'sense element' of the second sensor to the external environment (claim 1). This allows the sense element, for example a diaphragm in a pressure sensor, to move in response to an external stimulus like pressure (claim 2). Both the first and second sensors are then enclosed together within a 'hermetically sealed chamber' formed by a cap coupled to the 'first side' of the substrate (claim 1). This setup allows for sensors with different environmental exposure needs to be manufactured on the same chip, such as an inertial sensor (first sensor) and a pressure sensor (second sensor) (claim 3).",
  "what_it_does_not_cover": [
    "Does not cover a device where the first and second sensors are placed on opposite sides of the substrate, as both are required to be on the 'first side' (claim 1).",
    "Does not cover a device where the cavity for the second sensor's sense element does not extend completely through the substrate from the 'second side' (claim 1).",
    "Does not cover a device where both the first and second sensors are directly exposed to the external environment via through-substrate cavities.",
    "Does not cover a device that lacks a 'hermetically sealed chamber' enclosing both the first and second sensors (claim 1).",
    "Does not cover a device where the sensors are not 'laterally spaced apart' on the substrate, meaning they are at distinct locations (claim 1)."
  ],
  "filed": "2009-11-30",
  "granted": "2013-03-05",
  "expires": "2029-11-30",
  "status": "active",
  "holder": "Freescale Semiconductor",
  "holder_url": "https://patentbrief.org/company/freescale-semiconductor",
  "inventors": [
    {
      "name": "Andrew C. McNeil",
      "url": "https://patentbrief.org/inventor/andrew-c-mcneil"
    },
    {
      "name": "Woo Tae Park",
      "url": "https://patentbrief.org/inventor/woo-tae-park"
    },
    {
      "name": "Yizhen Lin",
      "url": "https://patentbrief.org/inventor/yizhen-lin"
    }
  ],
  "times_cited": 21,
  "tags": [
    "consumer_electronics",
    "telecommunications",
    "semiconductors",
    "software"
  ],
  "abstract": "A microelectromechanical systems (MEMS) sensor device ( 20 ) includes a substrate ( 22 ) having sensors ( 24, 26 ) disposed on the same side ( 28 ) of the substrate ( 22 ) and laterally spaced apart from one another. The sensor ( 26 ) includes a sense element ( 56 ), and the substrate ( 22 ) includes a cavity ( 58 ) extending through the substrate ( 22 ) from the backside ( 30 ) of the substrate ( 22 ) to expose the sense element ( 56 ) to an external environment ( 54 ). The sense element ( 56 ) is movable in response to a stimulus ( 52 ) from the environment ( 54 ) due to its exposure to the environment ( 54 ) via the cavity ( 58 ). Fabrication methodology ( 66 ) entails concurrently forming the sensors ( 24, 26 ) on substrate ( 22 ) by implementing MEMS process flow, followed by creating the cavity ( 58 ) through the substrate ( 22 ) to expose the sense element ( 56 ) to the environment ( 54 ).",
  "url": "https://patentbrief.org/patent/us/8387464/laterally-integrated-mems-sensor-device-with-multi-stimulus-sensing",
  "markdown_url": "https://patentbrief.org/patent/us/8387464/laterally-integrated-mems-sensor-device-with-multi-stimulus-sensing/md",
  "google_patents_url": "https://patents.google.com/patent/US8387464",
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}