# Connecting Computer Chips with a Special Bridge Die > This patent describes a system for connecting multiple computer chips side-by-side using a third, 'bridge' chip that has vertical tunnels (TSVs) to link them together. - **Patent:** US 7969009 - **Original title:** Through silicon via bridge interconnect - **Owner:** Qualcomm - **Granted:** 2011 - **Status:** Active - **Times cited:** 89 - **Field:** consumer_electronics, semiconductors, telecommunications ## What it does This patent details a way to connect two main computer chips (called the first and second die) that are placed next to each other. A third chip, the 'bridge die,' sits on top of these two chips and links them electrically. The bridge die has special vertical holes, called through-silicon vias (TSVs), that are filled with metal. These TSVs connect the wiring on the top of the bridge die to the bottom, allowing it to send signals between the two main chips. The patent also mentions that the bridge die can have its own active electronic circuits, and even more chips can be stacked on top of it. ## What it does NOT cover - Connecting chips that are stacked directly on top of each other without a side-by-side bridge die. - Systems where the bridge die does not have through-silicon vias. - Connecting chips using only wires bonded directly from one chip to another without an intermediate bridge die. - Chip systems where the main dies are not arranged in a side-by-side configuration. - Bridge dies that contain only passive interconnect lines and no active circuitry. ## The clever bit The innovation lies in using a dedicated bridge die with through-silicon vias to provide a high-density, efficient electrical connection between side-by-side dies, rather than relying on less efficient traditional interconnect methods or complex stacking arrangements. ## Real-world examples 1. Advanced mobile processors (SoCs) 2. High-performance computing chips 3. Multi-chip modules ## Why it matters This invention is a key part of how modern, powerful processors are built. By allowing multiple chips to be interconnected efficiently in a side-by-side arrangement, it enables the creation of complex System-on-Chip (SoC) designs that pack more functionality into a smaller space. This approach is fundamental to the high performance and miniaturization seen in mobile devices and advanced computing. ## Frequently asked questions ### What does Connecting Computer Chips with a Special Bridge Die cover? This patent describes a system for connecting multiple computer chips side-by-side using a third, 'bridge' chip that has vertical tunnels (TSVs) to link them together. ### Who owns patent US 7969009? Qualcomm owns this patent, granted in 2011. ### When does this patent expire? This patent is expected to expire on June 30, 2028, when the invention enters the public domain. ### What is patent US 7969009 cited by? This patent has been cited by 89 later patents that build on its ideas. ### What problem does this patent solve? This invention is a key part of how modern, powerful processors are built. By allowing multiple chips to be interconnected efficiently in a side-by-side arrangement, it enables the creation of complex System-on-Chip (SoC) designs that pack more functionality into a smaller space. This approach is fundamental to the high performance and miniaturization seen in mobile devices and advanced computing. ### What does this patent NOT cover? Connecting chips that are stacked directly on top of each other without a side-by-side bridge die. **Full plain-English explainer:** https://patentbrief.org/patent/us/7969009/through-silicon-via-bridge-interconnect **Original patent:** https://patents.google.com/patent/US7969009 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom. - [How to Stack Computer Chips on a Wafer for Smaller Devices](https://patentbrief.org/patent/us/7824959/wafer-level-stack-structure-for-system-in-package-and-method-thereof) — This patent describes a method for stacking two full wafers of computer chips, where the chips on each wafer are roughly the same overall size but have different active areas, to create a compact system-in-package. - [How a Fan-Out Chip Package Connects Multiple Chips on a Metal Substrate](https://patentbrief.org/patent/us/10181457/microelectronic-package-for-wafer-level-chip-scale-packaging-with-fan-out) — This patent describes a way to stack and connect multiple tiny computer chips using a metal base, allowing more connections to spread out from the chip. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [How Chips Are Stacked and Wired in Tiny Phone Parts](https://patentbrief.org/patent/us/8310051/package-on-package-with-fan-out-wlcsp) — MediaTek's 2012 patent describes a way to stack different types of computer chips, like a processor and memory, very closely together in a single package using special wiring that spreads out connections, saving space in devices like smartphones.