{
  "patent_number": "US 7969009",
  "country": "US",
  "title": "Connecting Computer Chips with a Special Bridge Die",
  "original_title": "Through silicon via bridge interconnect",
  "summary": "This patent describes a system for connecting multiple computer chips side-by-side using a third, 'bridge' chip that has vertical tunnels (TSVs) to link them together.",
  "what_it_does": "This patent details a way to connect two main computer chips (called the first and second die) that are placed next to each other. A third chip, the 'bridge die,' sits on top of these two chips and links them electrically. The bridge die has special vertical holes, called through-silicon vias (TSVs), that are filled with metal. These TSVs connect the wiring on the top of the bridge die to the bottom, allowing it to send signals between the two main chips. The patent also mentions that the bridge die can have its own active electronic circuits, and even more chips can be stacked on top of it.",
  "what_it_does_not_cover": [
    "Connecting chips that are stacked directly on top of each other without a side-by-side bridge die.",
    "Systems where the bridge die does not have through-silicon vias.",
    "Connecting chips using only wires bonded directly from one chip to another without an intermediate bridge die.",
    "Chip systems where the main dies are not arranged in a side-by-side configuration.",
    "Bridge dies that contain only passive interconnect lines and no active circuitry."
  ],
  "filed": "2008-06-30",
  "granted": "2011-06-28",
  "expires": "2028-06-30",
  "status": "active",
  "holder": "Qualcomm",
  "holder_url": "https://patentbrief.org/company/qualcomm",
  "inventors": [
    {
      "name": "Arvind Chandrasekaran",
      "url": "https://patentbrief.org/inventor/arvind-chandrasekaran"
    }
  ],
  "times_cited": 89,
  "tags": [
    "consumer_electronics",
    "semiconductors",
    "telecommunications"
  ],
  "abstract": "An integrated circuit bridge interconnect system includes a first die and a second die provided in a side-by-side configuration and electrically interconnected to each other by a bridge die. The bridge die includes through silicon vias (TSVs) to connect conductive interconnect lines on the bridge die to the first die and the second die. Active circuitry, other than interconnect lines, may be provided on the bridge die. At least one or more additional die may be stacked on the bridge die and interconnected to the bridge die.",
  "url": "https://patentbrief.org/patent/us/7969009/through-silicon-via-bridge-interconnect",
  "markdown_url": "https://patentbrief.org/patent/us/7969009/through-silicon-via-bridge-interconnect/md",
  "google_patents_url": "https://patents.google.com/patent/US7969009",
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}