# How Chips Talk Fast with Light Inside a Circuit Board > This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. - **Patent:** US 20260003141 - **Original title:** Package having component carrier and embedded optical and electric chips with horizontal signal path in between - **Owner:** AT&S Austria Technologie und Systemtechnik AG - **Status:** Active - **Times cited:** 0 - **Field:** semiconductors, telecommunications, consumer_electronics, ai_ml, high_performance_computing ## What it does This patent describes a special way to build a package for computer chips. It involves a 'component carrier,' which is like a tiny circuit board, where an 'optical chip' and an 'electric chip' are placed side-by-side and completely enclosed, or 'embedded,' within it (Claim 1). The key idea is that the main communication path between these two chips happens horizontally, within the same flat layer (Claim 1). For example, the optical chip might convert light signals into electrical signals, and the electric chip might process or amplify them (Claim 6). The package can also include an 'optical waveguide' to guide light signals to the optical chip, potentially along the surface of the component carrier (Claim 3, 4). This design aims to make chips communicate faster and more efficiently by keeping their direct signal path short and flat. ## What it does NOT cover - Does not cover optical and electric chips that are surface-mounted on top of a component carrier rather than embedded within it for their primary signal path. - Does not cover packages where the primary functional signal path between the optical and electric chip is vertical, such as through stacked dies. - Does not cover designs where the optical chip and electric chip are not physically side-by-side within the component carrier. - Does not cover packages that rely solely on external wiring or traces on the component carrier's surface for the direct signal path between the embedded chips. ## The clever bit The clever bit is embedding both optical and electric chips side-by-side within a component carrier, ensuring their direct signal path is horizontal. This minimizes the distance and complexity of the critical inter-chip communication, avoiding the longer paths and vertical connections often found in traditional chip stacking or surface mounting. ## Real-world examples 1. High-performance computing modules 2. Data center network interfaces 3. AI accelerator cards 4. Optical transceivers 5. Integrated photonics packages ## Why it matters As data processing demands grow, traditional electrical connections face speed and power limits. This patent addresses these challenges by integrating optical communication directly into chip packages. By placing optical and electric chips side-by-side with a horizontal signal path, it reduces signal travel distance and latency, which is crucial for high-performance computing and data centers. This approach can lead to more compact, energy-efficient, and faster electronic modules. ## Frequently asked questions ### What does How Chips Talk Fast with Light Inside a Circuit Board cover? This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. ### Who owns patent US 20260003141? This patent is owned by AT&S Austria Technologie und Systemtechnik AG. ### When does this patent expire? This patent is expected to expire on June 27, 2043, when the invention enters the public domain. ### What problem does this patent solve? As data processing demands grow, traditional electrical connections face speed and power limits. This patent addresses these challenges by integrating optical communication directly into chip packages. By placing optical and electric chips side-by-side with a horizontal signal path, it reduces signal travel distance and latency, which is crucial for high-performance computing and data centers. This approach can lead to more compact, energy-efficient, and faster electronic modules. ### What does this patent NOT cover? Does not cover optical and electric chips that are surface-mounted on top of a component carrier rather than embedded within it for their primary signal path. **Full plain-English explainer:** https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho **Original patent:** https://patents.google.com/patent/US20260003141 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication. - [How to Embed Tiny Optical Components Directly into Circuit Boards](https://patentbrief.org/patent/us/RE50510/gemini-bard) — A design for embedding light-emitting components and light-guiding paths directly into the layers of a circuit board to make devices smaller and more efficient. - [A Sealed, Stamped Metal Assembly for Guiding Light in Fiber Optics](https://patentbrief.org/patent/us/10761280/hermetic-optical-subassembly) — This patent describes a tiny, sealed optical assembly that uses precisely shaped metal parts and mirrors to guide light signals between a fiber optic cable and an electronic light-emitting or light-sensing device without needing lenses between the main mirrors. - [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.