{
  "patent_number": "US 20260003141",
  "country": "US",
  "title": "How Chips Talk Fast with Light Inside a Circuit Board",
  "original_title": "Package having component carrier and embedded optical and electric chips with horizontal signal path in between",
  "summary": "This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path.",
  "what_it_does": "This patent describes a special way to build a package for computer chips. It involves a 'component carrier,' which is like a tiny circuit board, where an 'optical chip' and an 'electric chip' are placed side-by-side and completely enclosed, or 'embedded,' within it (Claim 1). The key idea is that the main communication path between these two chips happens horizontally, within the same flat layer (Claim 1). For example, the optical chip might convert light signals into electrical signals, and the electric chip might process or amplify them (Claim 6). The package can also include an 'optical waveguide' to guide light signals to the optical chip, potentially along the surface of the component carrier (Claim 3, 4). This design aims to make chips communicate faster and more efficiently by keeping their direct signal path short and flat.",
  "what_it_does_not_cover": [
    "Does not cover optical and electric chips that are surface-mounted on top of a component carrier rather than embedded within it for their primary signal path.",
    "Does not cover packages where the primary functional signal path between the optical and electric chip is vertical, such as through stacked dies.",
    "Does not cover designs where the optical chip and electric chip are not physically side-by-side within the component carrier.",
    "Does not cover packages that rely solely on external wiring or traces on the component carrier's surface for the direct signal path between the embedded chips."
  ],
  "filed": "2023-06-27",
  "granted": null,
  "expires": "2043-06-27",
  "status": "active",
  "holder": "AT&S Austria Technologie und Systemtechnik AG",
  "holder_url": "https://patentbrief.org/company/ats-austria-technologie-und-systemtechnik-ag",
  "inventors": [
    {
      "name": "Tanja JOERG",
      "url": "https://patentbrief.org/inventor/tanja-joerg"
    },
    {
      "name": "Erich Schlaffer",
      "url": "https://patentbrief.org/inventor/erich-schlaffer"
    }
  ],
  "times_cited": 0,
  "tags": [
    "semiconductors",
    "telecommunications",
    "consumer_electronics",
    "ai_ml",
    "high_performance_computing"
  ],
  "abstract": "Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.",
  "url": "https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho",
  "markdown_url": "https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho/md",
  "google_patents_url": "https://patents.google.com/patent/US20260003141",
  "relatedPatents": []
}