# How to Clean Metal Off Wafers After EUV Chipmaking > This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips. - **Patent:** US 20250172879 - **Original title:** Metal-compound-removing solvent and method in lithography - **Owner:** Taiwan Semiconductor Manufacturing Co TSMC - **Status:** Active - **Times cited:** 0 - **Field:** semiconductors, consumer_electronics, telecommunications, software ## What it does This patent describes a system and method for cleaning semiconductor wafers after they've been processed using Extreme Ultraviolet (EUV) lithography. The system includes a chamber to coat a wafer with a "metal-containing photoresist material" (Claim 1). After patterning, "first nozzles" apply a "cleaning fluid" specifically designed to remove "metal contaminants" that come from this photoresist (Claim 1). The cleaning fluid contains a solvent with specific "Hansen solubility parameters" (delta D between 13-25, delta P between 3-25, delta H between 4-30) and an acid or base with a defined "acid dissociation constant" (Claim 2). "Second nozzles" then apply a "purging fluid" to further help remove these contaminants (Claim 1). The system can also spin the wafer (Claim 3) and spray fluids onto its backside or edges (Claims 6-9). For example, after an EUV exposure step, a wafer might have trace amounts of tin (Sn) from the photoresist, which this system's specialized cleaning fluid and process would remove to ensure the chip's quality. ## What it does NOT cover - Cleaning processes that do not use a metal-containing photoresist material in the EUV lithography step. - Cleaning fluids that do not meet the specified Hansen solubility parameters (delta D, P, H ranges). - Cleaning fluids that do not contain an acid with a pKa between -11 and 4, or a base with a pKa between 9 and 40. - Systems that do not include both distinct cleaning fluid nozzles and distinct purging fluid nozzles. - The use of non-EUV lithography processes for patterning the photoresist. ## The clever bit The novelty lies in precisely defining the chemical properties of the cleaning solvent using "Hansen solubility parameters" (delta D, P, H) in combination with a specific acid or base strength (acid dissociation constant). This allows for highly selective and efficient removal of specific metal contaminants, which is crucial for the extremely demanding purity requirements of EUV lithography. ## Real-world examples 1. Advanced semiconductor fabrication plants 2. EUV lithography process lines 3. Manufacturing of leading-edge CPUs 4. Production of high-density memory chips ## Why it matters As computer chips get smaller, the features printed on them become incredibly tiny, requiring advanced techniques like Extreme Ultraviolet (EUV) lithography. This process often uses photoresists that contain metals, which can leave behind minute metal contaminants. These contaminants can ruin the delicate chip structures, leading to defects. This patent addresses a critical step in manufacturing advanced semiconductors, ensuring the purity and performance of next-generation microprocessors and memory chips. ## Frequently asked questions ### What does How to Clean Metal Off Wafers After EUV Chipmaking cover? This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips. ### Who owns patent US 20250172879? This patent is owned by Taiwan Semiconductor Manufacturing Co TSMC. ### When does this patent expire? This patent is expected to expire on January 17, 2045, when the invention enters the public domain. ### What problem does this patent solve? As computer chips get smaller, the features printed on them become incredibly tiny, requiring advanced techniques like Extreme Ultraviolet (EUV) lithography. This process often uses photoresists that contain metals, which can leave behind minute metal contaminants. These contaminants can ruin the delicate chip structures, leading to defects. This patent addresses a critical step in manufacturing advanced semiconductors, ensuring the purity and performance of next-generation microprocessors and memory chips. ### What does this patent NOT cover? Cleaning processes that do not use a metal-containing photoresist material in the EUV lithography step. **Full plain-English explainer:** https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography **Original patent:** https://patents.google.com/patent/US20250172879 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [Making Tiny Chip Patterns Using Gas and Light](https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist) — This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips. - [How to Stack Computer Chips on a Wafer for Smaller Devices](https://patentbrief.org/patent/us/7824959/wafer-level-stack-structure-for-system-in-package-and-method-thereof) — This patent describes a method for stacking two full wafers of computer chips, where the chips on each wafer are roughly the same overall size but have different active areas, to create a compact system-in-package. - [How TSMC Makes Advanced Silicon-Based Light Sensors](https://patentbrief.org/patent/us/12310123/raptor-1) — A manufacturing process for high-performance light sensors that use alternating doped regions within a silicon-on-insulator structure to improve detection efficiency. - [How to Prepare 3D Flash Memory for Use](https://patentbrief.org/patent/us/9685235/method-of-initializing-3d-non-volatile-memory-device) — This patent describes a method for setting up a 3D non-volatile memory chip, like those in SSDs, by precisely programming control transistors, including a special "dummy" one, to make sure the memory works correctly. - [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.