# Flexible Silicon Chips That Send Data Using Light > This patent describes a flexible silicon chip that uses light to send data between different parts of a computer, making connections faster and potentially more compact. - **Patent:** US 20130230274 - **Original title:** Photonic flexible interconnect - **Owner:** Individual - **Status:** Active - **Times cited:** 33 - **Field:** semiconductors, telecommunications, consumer_electronics, data_centers ## What it does This patent describes a silicon photonic interconnect built on a silicon on insulator (SOI) substrate. It includes a waveguide, a tiny path for light, that has a specific 'first optical mode' (Claim 1). This interconnect is designed to exchange optical data with an integrated circuit (IC) through a 'coupling region' (Claim 1). A key feature is that this coupling region has a 'second optical mode larger than the first optical mode' (Claim 1), which helps light transfer efficiently. The interconnect can be made 'flexible' by adding a 'polymer layer' on the SOI substrate (Claim 2). It can connect to the IC using methods like 'evanescent coupling' (Claim 3), an 'optical grating' (Claim 4), or an 'etched taper' (Claim 5). It can also connect to external 'optical fiber connections' through a 'fiber coupling region' (Claim 7), which might use 'v-grooves' for alignment (Claim 8) or 'vertical couplers' to redirect light (Claim 9). For example, this technology could be used to create flexible optical cables that connect different processing units within a data center rack, replacing traditional electrical wires for higher speed. ## What it does NOT cover - Does not cover purely electrical interconnects that do not exchange 'optical data' (Claim 1). - Does not cover silicon photonic interconnects where the coupling region's optical mode is not larger than the SOI waveguide's optical mode (Claim 1). - Does not cover photonic interconnects built on substrates other than 'silicon on insulator (SOI)' (Claim 1). - Does not cover optical coupling to components that are not 'integrated circuits' or 'optical fiber connections' as described (Claims 1, 7). - Does not cover systems where the silicon photonic interconnect lacks a waveguide with a first optical mode (Claim 1). ## The clever bit The novelty lies in combining silicon photonics on an SOI substrate with a specific design for the coupling region, which has an optical mode larger than the waveguide it connects to (Claim 1). This 'mode matching' helps efficiently transfer light between the tiny on-chip waveguide and the larger components it connects to, minimizing signal loss. The optional flexible polymer layer (Claim 2) also offers a practical advantage for integration and packaging. ## Real-world examples 1. Optical transceivers in data centers 2. High-performance computing interconnects 3. Chip-to-chip optical links 4. Fiber optic communication modules ## Why it matters Traditional electrical connections struggle to keep up with the increasing demand for high-speed data transfer over short distances due to signal loss and interference. Optical interconnects, which use light instead of electricity, can carry much more data faster and with less power. This patent aims to make these optical connections more practical by integrating them directly with silicon chips and adding flexibility, which is crucial for compact packaging and efficient routing in modern electronics and data centers. ## Frequently asked questions ### What does Flexible Silicon Chips That Send Data Using Light cover? This patent describes a flexible silicon chip that uses light to send data between different parts of a computer, making connections faster and potentially more compact. ### Who owns patent US 20130230274? This patent is owned by Individual. ### When does this patent expire? This patent is expected to expire on March 5, 2032, when the invention enters the public domain. ### What is patent US 20130230274 cited by? This patent has been cited by 33 later patents that build on its ideas. ### What problem does this patent solve? Traditional electrical connections struggle to keep up with the increasing demand for high-speed data transfer over short distances due to signal loss and interference. Optical interconnects, which use light instead of electricity, can carry much more data faster and with less power. This patent aims to make these optical connections more practical by integrating them directly with silicon chips and adding flexibility, which is crucial for compact packaging and efficient routing in modern electronics and data centers. ### What does this patent NOT cover? Does not cover purely electrical interconnects that do not exchange 'optical data' (Claim 1). **Full plain-English explainer:** https://patentbrief.org/patent/us/20130230274/photonic-flexible-interconnect **Original patent:** https://patents.google.com/patent/US20130230274 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How Tiny Bumps in Light Paths Improve Chip Communication](https://patentbrief.org/patent/us/11137544/method-and-system-for-grating-couplers-incorporating-perturbed-waveguides) — This patent describes a way to make tiny light-directing structures on computer chips more efficient by adding small, irregular bumps or changes to the light paths, helping chips talk to each other faster using light. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication. - [A Photonic Chip Package with Edge Fiber Connections](https://patentbrief.org/patent/us/10598860/photonic-die-fan-out-package-with-edge-fiber-coupling-interface-and-related-meth) — This patent describes a compact package for a photonic chip that integrates electrical components and short optical fibers, allowing direct connection to external optical cables from the side. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [How to Precisely Connect Light Chips to Optical Fibers](https://patentbrief.org/patent/us/11150423/optical-and-thermal-interface-for-photonic-integrated-circuits) — This patent describes a clever way to accurately align tiny light-emitting components inside a photonic chip with an external optical connector, using a built-in alignment mark and a viewing hole.