{
  "patent_number": "US 20110120221",
  "country": "US",
  "title": "How a Tiny Sensor Uses an Extra Weight to Detect Motion",
  "original_title": "Mems sensor, method of manufacturing thereof, and electronic apparatus",
  "summary": "This patent describes a miniature sensor that detects movement or force by measuring changes in electrical signals between tiny plates, featuring a clever extra weight to make it more sensitive.",
  "what_it_does": "This patent details a tiny sensor, known as a MEMS sensor, designed to detect physical changes like movement or acceleration. It includes a stationary \"fixed portion\" and a \"movable weight portion\" connected by a flexible \"elastically deformable portion,\" acting like a miniature spring (Claim 1). The movable part has \"movable electrode portions\" that sit opposite \"fixed electrode portions.\" When the sensor moves, the movable weight shifts, changing the gap between these electrodes, which then alters an electrical signal. The core innovation is an \"additional weight portion\" attached to the movable part, which helps improve the sensor's performance. For instance, this sensor could be built into a smartwatch to accurately track your steps by sensing subtle wrist movements. The patent also describes a manufacturing method that involves etching a material from both its top and bottom surfaces to create this complex structure (Claim 11).",
  "what_it_does_not_cover": [
    "Does not cover MEMS sensors that lack an \"additional weight portion\" connected to the movable weight portion.",
    "Does not cover sensors where the fixed and movable electrodes are not arranged to face each other in a capacitive sensing setup.",
    "Does not cover manufacturing processes that do not involve etching the substrate from both sides to form the additional weight portion.",
    "Does not cover sensors that use different detection principles, such as piezoelectric or thermal, instead of capacitive sensing.",
    "Does not cover sensors where the movable element is not coupled to the fixed portion via an elastically deformable component."
  ],
  "filed": "2010-11-17",
  "granted": null,
  "expires": "2030-11-17",
  "status": "active",
  "holder": "Seiko Epson",
  "holder_url": "https://patentbrief.org/company/seiko-epson",
  "inventors": [
    {
      "name": "Mitsuhiro Yoda",
      "url": "https://patentbrief.org/inventor/mitsuhiro-yoda"
    }
  ],
  "times_cited": 40,
  "tags": [
    "consumer_electronics",
    "semiconductors",
    "telecommunications",
    "automotive",
    "robotics"
  ],
  "abstract": "A MEMS sensor includes: a fixed portion; an elastically deformable portion; a movable weight portion coupled to the fixed portion via the elastically deformable portion, the movable weight portion including a coupling portion; a plurality of fixed electrode portions arranged in a first direction and protruding in a second direction perpendicular to the first direction; and a plurality of movable electrode portions protruding from the coupling portion in the second direction, provided to respectively face the plurality of fixed electrode portions, and arranged in the first direction, wherein the movable weight portion has an additional weight portion connected to the coupling portion.",
  "url": "https://patentbrief.org/patent/us/20110120221/mems-sensor-method-of-manufacturing-thereof-and-electronic-apparatus",
  "markdown_url": "https://patentbrief.org/patent/us/20110120221/mems-sensor-method-of-manufacturing-thereof-and-electronic-apparatus/md",
  "google_patents_url": "https://patents.google.com/patent/US20110120221",
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}