{
  "patent_number": "US 12740412",
  "country": "US",
  "title": "Nanotubes for Better Cooling in Radio Frequency Chips",
  "original_title": "RF devices with nanotube particles for enhanced performance and methods of forming the same",
  "summary": "This patent describes a radio frequency device that uses tiny nanotube particles mixed into its protective casing to help the chip stay cooler and work better.",
  "what_it_does": "This patent details a radio frequency (RF) device that improves heat management using nanotube particles. The device includes a main chip, called a 'mold device die,' which has an active layer where most of the work and heat generation occurs. This die is covered by a protective 'first mold compound.' Critically, tiny nanotube particles are spread throughout the bottom part of this mold compound, specifically over the active layer and isolation sections of the chip. These nanotubes have a higher thermal conductivity than the mold compound alone, meaning they are better at moving heat. By placing these nanotubes directly where heat is generated, they act like tiny heat highways, pulling heat away from the active circuits and helping the chip stay cooler. For example, a 5G modem chip could use this technology to prevent overheating, allowing it to maintain high performance during heavy data traffic.",
  "what_it_does_not_cover": [
    "Does not cover devices using other high-thermal-conductivity particles, such as graphene flakes or metal powders, if they are not nanotubes.",
    "Does not cover cooling solutions where the nanotubes are not specifically dispersed within a mold compound, but perhaps in a different layer or structure.",
    "Does not cover devices where the nanotube particles are not located in the bottom portion of the mold compound or not positioned over the active layer.",
    "Does not cover devices that are not radio frequency devices, such as general-purpose processors or memory chips, unless they also incorporate RF functions.",
    "Does not cover cooling methods that rely solely on external heat sinks, fans, or liquid cooling systems, rather than internal mold compound enhancements."
  ],
  "filed": "2024-02-01",
  "granted": "2026-09-15",
  "expires": null,
  "status": "active",
  "holder": null,
  "holder_url": null,
  "inventors": [],
  "times_cited": 0,
  "tags": [
    "telecommunications",
    "consumer_electronics",
    "semiconductors",
    "materials"
  ],
  "abstract": "The present disclosure relates to a radio frequency device that includes a mold device die and a multilayer redistribution structure underneath the mold device die. The mold device die includes a device region with a back-end-of-line (BEOL) portion and a front-end-of-line (FEOL) portion over the BEOL portion, and a first mold compound with nanotube particles. The FEOL portion includes isolation sections and an active layer surrounded by the isolation sections. The nanotube particles are dispersed throughout a bottom portion of the first mold compound, and have a higher thermal conductivity than the first mold compound alone. The bottom portion of the first mold compound resides over the active layer and top surfaces of the isolation sections. The multilayer redistribution structure includes a number of bump structures, which are at a bottom of the multilayer redistribution structure and electrically coupled to the FEOL portion of the mold device die.",
  "url": "https://patentbrief.org/patent/us/12740412/rf-devices-with-nanotube-particles-for-enhanced-performance-and-methods-of",
  "markdown_url": "https://patentbrief.org/patent/us/12740412/rf-devices-with-nanotube-particles-for-enhanced-performance-and-methods-of/md",
  "google_patents_url": "https://patents.google.com/patent/US12740412",
  "relatedPatents": []
}