# Measuring Focus in Multi-Beam Tools for Tiny Electronics Manufacturing > This patent describes a method to precisely measure how focused tiny particle beams are in advanced manufacturing machines by slightly tilting them and observing where they hit a target. - **Patent:** US 12738453 - **Original title:** Method for determining focal properties in a target beam field of a multi-beam charged-particle processing apparatus - **Granted:** 2026 - **Status:** Active - **Times cited:** 0 - **Field:** semiconductors, manufacturing, materials, nanotechnology, precision_engineering ## What it does This patent details a method for figuring out how well focused the individual tiny beams, called beamlets, are in a charged-particle multi-beam processing apparatus. To do this, the system slightly changes an electrostatic voltage in a lens, or another setting in its projection optics, which causes the beamlets to tilt. This tilt makes the beamlets land in slightly different spots on the target surface. By measuring how much the landing positions shift and knowing how much the beamlets tilted, the system creates a map. This map, often made using a mathematical model, then allows the system to extract specific focal properties like the height of focus, astigmatic length, or the size of any blur, which can then be used to correct imaging errors. ## What it does NOT cover - Does not cover single-beam charged-particle processing apparatus, as it specifically addresses 'multi-beam' systems. - Does not cover determining focal properties using methods other than tilting beamlets and measuring their displacement. - Does not cover the actual correction of imaging errors, only the process of determining the focal properties that can then be used for correction. - Does not cover determining other types of imaging errors beyond focal properties like height of focus, astigmatic length, or blur size. - Does not cover apparatuses that do not modify an electrostatic voltage of a lens or a similar operating parameter to tilt the beamlets. ## The clever bit The clever bit is using a small, controlled tilt of the beamlets and precisely measuring their displacement to indirectly calculate complex focal properties. This avoids needing direct, difficult-to-obtain measurements of the beam's focus at the target itself. ## Real-world examples 1. Electron beam lithography tools for semiconductor manufacturing 2. Ion beam etching systems 3. Multi-beam inspection tools for wafer defects 4. Advanced microscopy systems using multiple charged-particle beams ## Why it matters In advanced manufacturing, especially for computer chips, tools that use charged particles need extreme precision to create tiny features. If the particle beams aren't perfectly focused, the resulting products can have flaws. This method provides a way to accurately measure these focusing issues, allowing machines to be tuned for optimal performance and ensuring the quality of very small components. ## Frequently asked questions ### What does Measuring Focus in Multi-Beam Tools for Tiny Electronics Manufacturing cover? This patent describes a method to precisely measure how focused tiny particle beams are in advanced manufacturing machines by slightly tilting them and observing where they hit a target. ### When does this patent expire? This patent is expected to expire on September 15, 2046, when the invention enters the public domain. ### What problem does this patent solve? In advanced manufacturing, especially for computer chips, tools that use charged particles need extreme precision to create tiny features. If the particle beams aren't perfectly focused, the resulting products can have flaws. This method provides a way to accurately measure these focusing issues, allowing machines to be tuned for optimal performance and ensuring the quality of very small components. ### What does this patent NOT cover? Does not cover single-beam charged-particle processing apparatus, as it specifically addresses 'multi-beam' systems. **Full plain-English explainer:** https://patentbrief.org/patent/us/12738453/method-for-determining-focal-properties-in-a-target-beam-field-of-a-multi-beam **Original patent:** https://patents.google.com/patent/US12738453 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [Making Tiny Chip Patterns Using Gas and Light](https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist) — This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips. - [How to Clean Tiny Chip Patterns Using a Special Chemical Developer](https://patentbrief.org/patent/us/10866511/extreme-ultraviolet-photolithography-method-with-developer-composition) — This patent describes a method for making advanced computer chips using extreme ultraviolet light and a special chemical developer that cleans away tiny metal leftover bits from the chip's patterns. - [Making Tiny Chip Patterns with Special Metal-Filled Ink](https://patentbrief.org/patent/us/10825684/material-composition-and-methods-thereof) — This patent describes a new light-sensitive material, called a resist, that uses special multi-metal complexes to create incredibly small patterns on computer chips using extreme ultraviolet light. - [How a Special Coating Stops Materials from Sticking](https://patentbrief.org/patent/us/12740286/nucleation-inhibiting-coating-containing-rare-earth-compounds-and-devices) — This patent describes a device with a special coating, made with rare earth elements, that prevents other materials from sticking to it, allowing for precise material placement on other surfaces. - [How to Clean Metal Off Wafers After EUV Chipmaking](https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography) — This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips.