# A Stamped Mirror to Connect Optical Fibers to Tiny Light Chips > This patent describes a method to precisely connect a standard optical fiber to a tiny light-based computer chip (a photonic integrated circuit) using a specially shaped, stamped mirror that redirects and reshapes the light. - **Patent:** US 12422629 - **Original title:** Optical connection of optical fibers to grating couplers - **Owner:** Senko Advanced Components - **Granted:** 2025 - **Status:** Active - **Times cited:** 0 - **Field:** telecommunications, semiconductors, consumer_electronics, mechanical ## What it does The patent describes an optical coupling that uses a "stamped optical bench" with a "structured reflective surface" (a mirror) to connect a single-mode optical fiber to a grating coupler on a photonic integrated circuit (PIC). This mirror "turns light transmitted between the grating coupler and the optical fiber" (Claim 1). Crucially, the mirror's "reflective surface profile" is shaped to "reshape the light" (Claim 1) to perfectly match the light coming from the fiber to the grating coupler's "design angle." For example, it can make light from a "flat polished optical fiber" look like it came from an "angled polished optical fiber" (Claim 2), which many existing grating couplers are designed for. The entire "optical bench" and the "fiber alignment structure" are made at the same time by "precision stamping a malleable metal body" (Claim 3). ## What it does NOT cover - Does not cover systems that use a separate "refractive optical element" (like a lens) between the fiber and the mirror to reshape the light (Claims 4, 5, 6). - Does not cover systems where the mirror is not "stamped" or where the fiber alignment structure is not formed "integrally/simultaneously" with the mirror (Claim 3). - Does not cover using multi-mode optical fibers; it specifically claims a "single-mode fiber" (Claim 1). - Does not cover reflective surfaces that are not "three-dimensional concave reflective ellipsoidal" (Claim 1). ## The clever bit The clever bit is using a single, precision-stamped metal part that acts as both a mirror and an alignment structure. This mirror is not just for redirecting light, but its specific "three-dimensional concave reflective ellipsoidal surface profile" actively reshapes the light beam to perfectly match the receiving component, all without needing separate lenses. ## Real-world examples 1. High-speed optical transceivers 2. Data center interconnects 3. Telecommunications equipment 4. Optical sensors ## Why it matters Connecting optical fibers to photonic integrated circuits (PICs) is a major challenge in modern technology. PICs are becoming central to high-speed data communication and computing. This patent offers a manufacturing-friendly way to achieve precise optical alignment, which is critical for reliable and efficient light transmission in these systems. It addresses a bottleneck in packaging and integration. ## Frequently asked questions ### What does A Stamped Mirror to Connect Optical Fibers to Tiny Light Chips cover? This patent describes a method to precisely connect a standard optical fiber to a tiny light-based computer chip (a photonic integrated circuit) using a specially shaped, stamped mirror that redirects and reshapes the light. ### Who owns patent US 12422629? Senko Advanced Components owns this patent, granted in 2025. ### When does this patent expire? This patent is expected to expire on March 16, 2041, when the invention enters the public domain. ### What problem does this patent solve? Connecting optical fibers to photonic integrated circuits (PICs) is a major challenge in modern technology. PICs are becoming central to high-speed data communication and computing. This patent offers a manufacturing-friendly way to achieve precise optical alignment, which is critical for reliable and efficient light transmission in these systems. It addresses a bottleneck in packaging and integration. ### What does this patent NOT cover? Does not cover systems that use a separate "refractive optical element" (like a lens) between the fiber and the mirror to reshape the light (Claims 4, 5, 6). **Full plain-English explainer:** https://patentbrief.org/patent/us/12422629/optical-connection-of-optical-fibers-to-grating-couplers **Original patent:** https://patents.google.com/patent/US12422629 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [A Sealed, Stamped Metal Assembly for Guiding Light in Fiber Optics](https://patentbrief.org/patent/us/10761280/hermetic-optical-subassembly) — This patent describes a tiny, sealed optical assembly that uses precisely shaped metal parts and mirrors to guide light signals between a fiber optic cable and an electronic light-emitting or light-sensing device without needing lenses between the main mirrors. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [How a Special Fiber Stub Cleans Up Light Signals](https://patentbrief.org/patent/us/7267494/fiber-stub-for-cladding-mode-coupling-reduction) — This patent describes a short piece of optical fiber, called a fiber stub, designed to prevent unwanted light from escaping the fiber's core and interfering with data transmission by using a ferrule with a specific optical property. - [How Chips Talk Fast with Light Inside a Circuit Board](https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho) — This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication.