{
  "patent_number": "US 12326604",
  "country": "US",
  "title": "How Chips Get Both Light and Electricity on a Special Glass Base",
  "original_title": "Integrated circuit packages having electrical and optical connectivity and methods of making the same",
  "summary": "This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient.",
  "what_it_does": "The patent describes an integrated circuit package that uses a glass substrate, which includes a glass core layer and a glass cladding layer, with one or more cavities (Claim 1). An integrated circuit chip is positioned in these cavities (Claim 1). This chip is connected electrically through \"redistribution layers\" and optically through an \"optical channel\" (Claim 1). The optical channel can include a glass waveguide embedded within the glass, which guides light signals (Claim 5). For example, a photonic integrated circuit (PIC) chip, which uses light, can be placed in a cavity and communicate optically with the glass waveguide, while also connecting electrically to other parts of the package via the redistribution layers.",
  "what_it_does_not_cover": [
    "Integrated circuit packages that only use electrical connections and do not include an optical channel for light signals.",
    "Packages where the integrated circuit chip is not positioned within a cavity formed in the glass substrate.",
    "Packages that use substrates made from materials other than glass, such as silicon wafers or organic laminates.",
    "Optical connections that do not involve a glass waveguide embedded within the optical channel of the glass substrate.",
    "Integrated circuit packages where the optical channel is not structurally part of the glass substrate itself."
  ],
  "filed": "2024-06-07",
  "granted": "2025-06-10",
  "expires": "2044-06-07",
  "status": "active",
  "holder": "Corning",
  "holder_url": "https://patentbrief.org/company/corning",
  "inventors": [
    {
      "name": "Aramais Robert Zakharian",
      "url": "https://patentbrief.org/inventor/aramais-robert-zakharian"
    },
    {
      "name": "Jin Su Kim",
      "url": "https://patentbrief.org/inventor/jin-su-kim"
    },
    {
      "name": "Lars Martin Otfried Brusberg",
      "url": "https://patentbrief.org/inventor/lars-martin-otfried-brusberg"
    }
  ],
  "times_cited": 1,
  "tags": [
    "consumer_electronics",
    "telecommunications",
    "semiconductors",
    "ai_ml"
  ],
  "abstract": "Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.",
  "url": "https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho",
  "markdown_url": "https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho/md",
  "google_patents_url": "https://patents.google.com/patent/US12326604",
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}