{
  "patent_number": "US 12233592",
  "country": "US",
  "title": "3D Printing Conductive Plastics Without Melting Them",
  "original_title": "Solid-state additive manufacturing methods for compounding conductive polymer compositions",
  "summary": "This patent describes a method for 3D printing objects and coatings from conductive plastics by mixing polymer and conductive fillers in a solid-state process, rather than melting them, to create parts that can conduct electricity or heat.",
  "what_it_does": "This method creates conductive plastic parts or coatings using a process called solid-state additive manufacturing. It involves feeding at least one conductive solid filler (like carbon nanotubes or graphite) and at least one polymer or plastic through a hollow spindle or tool. This tool has a shoulder that rotates, applying normal, shear, and frictional forces. These forces cause the materials to deform plastically, meaning they change shape permanently without fully melting, entering a malleable or visco-elastic state. The materials are then deposited onto a substrate, forming a conductive 3D object or a coating, which can be electrically conductive, thermally conductive, or both, as described in claim 1 and 5. For example, it can create an anti-static coating (claim 8) or a coating for electromagnetic interference (EMI) shielding (claim 10).",
  "what_it_does_not_cover": [
    "Does not cover traditional 3D printing methods that fully melt plastic filaments, like Fused Deposition Modeling (FDM) or Fused Filament Fabrication (FFF).",
    "Does not cover additive manufacturing techniques that rely on liquid resins (SLA) or powder beds (SLS, binder jetting) without the specific solid-state deformation process.",
    "Does not cover creating conductive plastic parts by simply mixing pre-made conductive plastic pellets and then melting them in a conventional injection molding process.",
    "Does not cover methods that achieve conductivity by coating a non-conductive plastic part after it has been formed, rather than during the additive manufacturing process.",
    "Does not cover processes that do not involve generating plastic deformation through normal, shear, and/or frictional forces from a rotating hollow spindle or tool."
  ],
  "filed": "2021-03-10",
  "granted": "2025-02-25",
  "expires": "2041-03-10",
  "status": "active",
  "holder": "Meld Manufacturing",
  "holder_url": "https://patentbrief.org/company/meld-manufacturing",
  "inventors": [
    {
      "name": "Anita T. Broach",
      "url": "https://patentbrief.org/inventor/anita-t-broach"
    },
    {
      "name": "Chase Cox",
      "url": "https://patentbrief.org/inventor/chase-cox"
    },
    {
      "name": "Nanci Hardwick",
      "url": "https://patentbrief.org/inventor/nanci-hardwick"
    }
  ],
  "times_cited": 0,
  "tags": [
    "materials",
    "additive_manufacturing",
    "consumer_electronics",
    "telecommunications",
    "recycling"
  ],
  "abstract": "Solid-state additive manufacturing methods for compounding conductive plastic compositions, fabrication of conductive plastic parts and conductive coatings, and plastic recycling are disclosed. Electrically conductive or thermally conductive plastic compositions are compounded and subsequently printed with the solid-state additive manufacturing system. The solid-state fabricated compositions, parts and coatings can also be manufactured to be both thermally and electrically conductive. Solid-state plastic waste recycling methods are also disclosed where various plastic waste materials and shapes are solid-state processed. The plastic waste can be mixed with virgin plastic material or mixed with other types of materials such as metals, ceramics or their combination. The waste plastic feedstock is reinforced with different types of reinforcing particles or fibers, or various additives are added for improving properties of the final deposits.",
  "url": "https://patentbrief.org/patent/us/12233592/solid-state-additive-manufacturing-methods-for-compounding-conductive-polymer-co",
  "markdown_url": "https://patentbrief.org/patent/us/12233592/solid-state-additive-manufacturing-methods-for-compounding-conductive-polymer-co/md",
  "google_patents_url": "https://patents.google.com/patent/US12233592",
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}