# How to Make Reusable Plastic SIM Card Holders > A design for a plastic card that allows users to pop out and snap back in different sizes of SIM cards without them falling out. - **Patent:** US 12086666 - **Original title:** Layered structures with cutting lines - **Owner:** Covestro Deutschland AG - **Granted:** 2024 - **Status:** Active - **Times cited:** 0 - **Field:** consumer_electronics, telecommunications, materials ## What it does This patent describes a specialized plastic card structure designed to hold SIM cards of various sizes (2FF, 3FF, and 4FF) within a single frame. The structure uses precise cutting lines that go all the way through the material, allowing a user to manually push out a specific SIM card size and then snap it back into place. The material is a high-heat-resistant polycarbonate blend that ensures the card stays flat and holds its shape, even after being popped out and reinserted. It requires a specific amount of force (between 0.5 and 5 Newtons) to remove or reinsert the parts, ensuring they are secure but easy to use. ## What it does NOT cover - Does not cover cards made from non-polymeric materials like paper or metal. - Does not cover structures that do not meet the specific Vicat softening temperature of at least 85 degrees Celsius. - Does not cover SIM card holders that are designed for permanent removal without the ability to reinsert the card into the frame. - Does not cover cards that require specialized tools or machinery to extract the SIM portions. ## The clever bit The innovation lies in the specific material properties and cutting precision that allow for a 'reinsertable' fit. By balancing the material's softening temperature and thickness, the inventors created a frame that holds the SIM card securely enough to stay in place during shipping, yet allows for easy manual removal and replacement without damaging the card edges. ## Real-world examples 1. Standard plastic SIM card frames provided by mobile network operators 2. Multi-size SIM card adapters included with new mobile devices ## Why it matters As mobile phones have evolved, SIM cards have shrunk from credit-card size to tiny chips. This invention solves the practical problem of how to provide a user with a card that can adapt to different phone slots while remaining durable enough to be handled and reused without the small pieces falling out or warping. ## Frequently asked questions ### What does How to Make Reusable Plastic SIM Card Holders cover? A design for a plastic card that allows users to pop out and snap back in different sizes of SIM cards without them falling out. ### Who owns patent US 12086666? Covestro Deutschland AG owns this patent, granted in 2024. ### When does this patent expire? This patent is expected to expire on September 10, 2044, when the invention enters the public domain. ### What problem does this patent solve? As mobile phones have evolved, SIM cards have shrunk from credit-card size to tiny chips. This invention solves the practical problem of how to provide a user with a card that can adapt to different phone slots while remaining durable enough to be handled and reused without the small pieces falling out or warping. ### What does this patent NOT cover? Does not cover cards made from non-polymeric materials like paper or metal. **Full plain-English explainer:** https://patentbrief.org/patent/us/12086666/starship-depot-variant **Original patent:** https://patents.google.com/patent/US12086666 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How Machines Build 3D Objects Layer by Layer from Melting Plastic](https://patentbrief.org/patent/us/5121329/fdm-3d-printing-stratasys) — This patent describes a method and machine for creating three-dimensional objects by precisely depositing melted material, layer by layer, from a movable nozzle onto a base. - [Attaching Flexible Circuits with Light Sensors to a Chip](https://patentbrief.org/patent/us/9055681/method-for-attaching-a-flexible-structure-to-a-device-and-a-device-having-a-flex) — This patent describes a method and device for attaching a bendable circuit, which includes light-sensing or light-emitting components, onto a main chip, allowing light to pass through a hole in the chip to reach the flexible part. - [How to 3D Print Metal Parts with Easy-to-Remove Supports](https://patentbrief.org/patent/us/12358049/interface-layers-for-removable-supports) — This patent describes a method for 3D printing complex metal objects with support structures that can be easily removed after the final part is made solid, by using a special non-stick layer in between. - [How to Make Waste-Free Plastic Grocery Bags on a Roll](https://patentbrief.org/patent/us/12043450/starship-radiation-protection) — A design for plastic grocery bags on a roll that eliminates leftover scrap material during manufacturing while allowing users to easily tear off and open handles. - [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.