{
  "patent_number": "US 12086666",
  "country": "US",
  "title": "How to Make Reusable Plastic SIM Card Holders",
  "original_title": "Layered structures with cutting lines",
  "summary": "A design for a plastic card that allows users to pop out and snap back in different sizes of SIM cards without them falling out.",
  "what_it_does": "This patent describes a specialized plastic card structure designed to hold SIM cards of various sizes (2FF, 3FF, and 4FF) within a single frame. The structure uses precise cutting lines that go all the way through the material, allowing a user to manually push out a specific SIM card size and then snap it back into place. The material is a high-heat-resistant polycarbonate blend that ensures the card stays flat and holds its shape, even after being popped out and reinserted. It requires a specific amount of force (between 0.5 and 5 Newtons) to remove or reinsert the parts, ensuring they are secure but easy to use.",
  "what_it_does_not_cover": [
    "Does not cover cards made from non-polymeric materials like paper or metal.",
    "Does not cover structures that do not meet the specific Vicat softening temperature of at least 85 degrees Celsius.",
    "Does not cover SIM card holders that are designed for permanent removal without the ability to reinsert the card into the frame.",
    "Does not cover cards that require specialized tools or machinery to extract the SIM portions."
  ],
  "filed": "2020-12-10",
  "granted": "2024-09-10",
  "expires": null,
  "status": "active",
  "holder": "Covestro Deutschland AG",
  "holder_url": "https://patentbrief.org/company/covestro-deutschland-ag",
  "inventors": [
    {
      "name": "Daopeng WANG",
      "url": "https://patentbrief.org/inventor/daopeng-wang"
    },
    {
      "name": "Stefan Janke",
      "url": "https://patentbrief.org/inventor/stefan-janke"
    },
    {
      "name": "Kira Planken",
      "url": "https://patentbrief.org/inventor/kira-planken"
    },
    {
      "name": "Heinz Pudleiner",
      "url": "https://patentbrief.org/inventor/heinz-pudleiner"
    },
    {
      "name": "Yizhe ZHAO",
      "url": "https://patentbrief.org/inventor/yizhe-zhao"
    },
    {
      "name": "Christoph Koehler",
      "url": "https://patentbrief.org/inventor/christoph-koehler"
    },
    {
      "name": "Meng Feng",
      "url": "https://patentbrief.org/inventor/meng-feng"
    },
    {
      "name": "Roland Kuenzel",
      "url": "https://patentbrief.org/inventor/roland-kuenzel"
    },
    {
      "name": "Georgios Tziovaras",
      "url": "https://patentbrief.org/inventor/georgios-tziovaras"
    }
  ],
  "times_cited": 0,
  "tags": [
    "consumer_electronics",
    "telecommunications",
    "materials"
  ],
  "abstract": "The invention is related to a layered structure with at least one layer a. of a material with a VST≥85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.",
  "url": "https://patentbrief.org/patent/us/12086666/starship-depot-variant",
  "markdown_url": "https://patentbrief.org/patent/us/12086666/starship-depot-variant/md",
  "google_patents_url": "https://patents.google.com/patent/US12086666",
  "relatedPatents": []
}