# How to Build a Compact Optical Transmitter for Data Networks > This patent describes a tiny, self-contained package for an optical transmitter that includes a laser, a cooling system, and lenses, all precisely aligned to send light signals into an optical fiber. - **Patent:** US 11355900 - **Original title:** Small form factor transmitting device - **Owner:** Marvell Asia Pte - **Granted:** 2022 - **Status:** Active - **Times cited:** 1 - **Field:** telecommunications, semiconductors, consumer_electronics ## What it does This patent details a compact, packaged optical transmitter device. It uses a base member with a flat part that holds a thermoelectric cooler module, a transmitter module, and an optical coupling lens, along with an assembling part on its side (Claim 1). A circuit board is bent so one end connects to the cooler and transmitter on the flat part, while the other end, raised higher, has an electrical port for outside connections (Claim 1). A cover sits over the main components. Crucially, a cylindrical part attaches to the assembling part, holding an isolator and a second lens, which are precisely aligned to guide the light signal from the transmitter into an external optical fiber (Claim 1). For example, this design allows a tiny laser diode (Claim 3) to be kept at a stable temperature by the cooler (Claim 2) and its light accurately directed into a hair-thin fiber. ## What it does NOT cover - Does not cover optical transmitters that do not use a thermoelectric cooler for temperature regulation. - Does not cover devices where the circuit board is not bent or where its electrical port is not raised to a higher level. - Does not cover optical coupling systems that lack both an isolator and a second lens for connecting to an optical fiber. - Does not cover packaging where the optical components cannot be precisely aligned using specific plane and distance adjusting mechanisms. - Does not cover the individual components like laser diodes or isolators when they are not part of this specific integrated package. ## The clever bit The novelty lies in the highly integrated and adjustable packaging design. It combines thermal control, a bended circuit board for space efficiency, and multiple lenses with precise alignment mechanisms into a single, small form factor, ensuring stable and efficient optical signal coupling. ## Real-world examples 1. QSFP-DD optical transceivers 2. Coherent optical modules for long-haul networks 3. Transmitter components in fiber-to-the-home (FTTH) systems 4. High-speed optical interconnects for data centers ## Why it matters This patent addresses the challenge of making optical transmitters smaller, more reliable, and easier to manufacture. By integrating thermal management, precise optical alignment, and electrical connections into a single, compact package, it enables higher data rates and greater density in network equipment. This is vital for modern data centers and telecommunication networks that demand ever-increasing bandwidth in smaller physical footprints. ## Frequently asked questions ### What does How to Build a Compact Optical Transmitter for Data Networks cover? This patent describes a tiny, self-contained package for an optical transmitter that includes a laser, a cooling system, and lenses, all precisely aligned to send light signals into an optical fiber. ### Who owns patent US 11355900? Marvell Asia Pte owns this patent, granted in 2022. ### When does this patent expire? This patent is expected to expire on December 8, 2040, when the invention enters the public domain. ### What is patent US 11355900 cited by? This patent has been cited by 1 later patents that build on its ideas. ### What problem does this patent solve? This patent addresses the challenge of making optical transmitters smaller, more reliable, and easier to manufacture. By integrating thermal management, precise optical alignment, and electrical connections into a single, compact package, it enables higher data rates and greater density in network equipment. This is vital for modern data centers and telecommunication networks that demand ever-increasing bandwidth in smaller physical footprints. ### What does this patent NOT cover? Does not cover optical transmitters that do not use a thermoelectric cooler for temperature regulation. **Full plain-English explainer:** https://patentbrief.org/patent/us/11355900/small-form-factor-transmitting-device **Original patent:** https://patents.google.com/patent/US11355900 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How to Precisely Connect Light Chips to Optical Fibers](https://patentbrief.org/patent/us/11150423/optical-and-thermal-interface-for-photonic-integrated-circuits) — This patent describes a clever way to accurately align tiny light-emitting components inside a photonic chip with an external optical connector, using a built-in alignment mark and a viewing hole. - [A Photonic Chip Package with Edge Fiber Connections](https://patentbrief.org/patent/us/10598860/photonic-die-fan-out-package-with-edge-fiber-coupling-interface-and-related-meth) — This patent describes a compact package for a photonic chip that integrates electrical components and short optical fibers, allowing direct connection to external optical cables from the side. - [A Sealed, Stamped Metal Assembly for Guiding Light in Fiber Optics](https://patentbrief.org/patent/us/10761280/hermetic-optical-subassembly) — This patent describes a tiny, sealed optical assembly that uses precisely shaped metal parts and mirrors to guide light signals between a fiber optic cable and an electronic light-emitting or light-sensing device without needing lenses between the main mirrors. - [How Chips Talk Fast with Light Inside a Circuit Board](https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho) — This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient.