# How to Precisely Connect Light Chips to Optical Fibers > This patent describes a clever way to accurately align tiny light-emitting components inside a photonic chip with an external optical connector, using a built-in alignment mark and a viewing hole. - **Patent:** US 11150423 - **Original title:** Optical and thermal interface for photonic integrated circuits - **Owner:** Aurrion - **Granted:** 2021 - **Status:** Active - **Times cited:** 1 - **Field:** telecommunications, semiconductors, consumer_electronics, software, ai_ml ## What it does This patent describes an optical apparatus that precisely connects a photonic integrated circuit (PIC) to an optical interface unit. The PIC has a light emitter that sends light through its material to the optical interface unit, which is attached to the PIC's bottom side (claim 1). To ensure perfect alignment, the PIC includes a special "alignment feature" on its top side, which is built at a known, fixed distance from the light emitter (claim 1). A small "hole" extends from the top side of the PIC down to the bottom, allowing a clear view of this alignment feature from the same side where the optical interface unit connects (claim 1). This setup allows for very accurate positioning of the optical interface unit relative to the light emitter. For example, when manufacturing, a camera could look through the hole to see the alignment feature and then precisely place the optical interface unit based on its known offset from the light emitter. The patent also mentions a heat spreader layer around the optical interface unit to manage heat (claim 10). ## What it does NOT cover - Does not cover alignment methods where the alignment feature is not offset by a predetermined distance from the light emitter (claim 1). - Does not cover systems where the alignment feature is viewed from the same side as the light emitter, rather than through a hole from the opposite side (claim 1). - Does not cover optical apparatuses that lack a hole extending from the first side to provide a line of sight to the alignment feature (claim 1). - Does not cover systems where the optical interface unit is not connected to the second side of the photonic integrated circuit (claim 1). - Does not cover alignment techniques that do not involve a heat spreader layer surrounding the optical interface unit (claim 10). ## The clever bit The novelty lies in creating an alignment feature directly on the PIC's top surface, offset by a precise, predetermined distance from the light emitter, and then providing a viewing hole through the PIC to see this feature from the bottom. This allows for highly accurate, "self-referenced" alignment during assembly, even when the light emitter itself is hidden. ## Real-world examples 1. High-speed optical transceivers in data centers 2. Fiber optic communication modules 3. Lidar systems for autonomous vehicles 4. Optical sensors for medical diagnostics 5. Quantum computing interconnects ## Why it matters Photonic integrated circuits are crucial for high-speed data communication, sensing, and computing. Accurately connecting these tiny light-based chips to external optical fibers or lenses is a significant manufacturing challenge. This patent addresses that by providing a robust, repeatable method for precise alignment and thermal management, which is essential for reliable and high-performance photonic systems. This precision helps reduce signal loss and improve the efficiency of light transmission, impacting industries relying on optical data transfer. ## Frequently asked questions ### What does How to Precisely Connect Light Chips to Optical Fibers cover? This patent describes a clever way to accurately align tiny light-emitting components inside a photonic chip with an external optical connector, using a built-in alignment mark and a viewing hole. ### Who owns patent US 11150423? Aurrion owns this patent, granted in 2021. ### When does this patent expire? This patent is expected to expire on March 9, 2040, when the invention enters the public domain. ### What is patent US 11150423 cited by? This patent has been cited by 1 later patents that build on its ideas. ### What problem does this patent solve? Photonic integrated circuits are crucial for high-speed data communication, sensing, and computing. Accurately connecting these tiny light-based chips to external optical fibers or lenses is a significant manufacturing challenge. This patent addresses that by providing a robust, repeatable method for precise alignment and thermal management, which is essential for reliable and high-performance photonic systems. This precision helps reduce signal loss and improve the efficiency of light transmission, impacting industries relying on optical data transfer. ### What does this patent NOT cover? Does not cover alignment methods where the alignment feature is not offset by a predetermined distance from the light emitter (claim 1). **Full plain-English explainer:** https://patentbrief.org/patent/us/11150423/optical-and-thermal-interface-for-photonic-integrated-circuits **Original patent:** https://patents.google.com/patent/US11150423 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [A Photonic Chip Package with Edge Fiber Connections](https://patentbrief.org/patent/us/10598860/photonic-die-fan-out-package-with-edge-fiber-coupling-interface-and-related-meth) — This patent describes a compact package for a photonic chip that integrates electrical components and short optical fibers, allowing direct connection to external optical cables from the side. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [A Stamped Mirror to Connect Optical Fibers to Tiny Light Chips](https://patentbrief.org/patent/us/12422629/optical-connection-of-optical-fibers-to-grating-couplers) — This patent describes a method to precisely connect a standard optical fiber to a tiny light-based computer chip (a photonic integrated circuit) using a specially shaped, stamped mirror that redirects and reshapes the light. - [How Chips Talk Fast with Light Inside a Circuit Board](https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho) — This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. - [Flexible Silicon Chips That Send Data Using Light](https://patentbrief.org/patent/us/20130230274/photonic-flexible-interconnect) — This patent describes a flexible silicon chip that uses light to send data between different parts of a computer, making connections faster and potentially more compact.